Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Monitoring marking layout for microlens baking process

A microlens and layout technology, which is applied to lenses, photolithography process exposure devices, microlithography exposure equipment, etc., can solve the problem of inability to evaluate the flow of photoresist. The quality of the microlens array, poor efficiency, and difficulty in reflective patterns And other issues

Active Publication Date: 2008-03-05
UNITED MICROELECTRONICS CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is not only inefficient, but also as the thickness of the microlens gradually shrinks, it becomes more and more difficult to distinguish the reflective pattern with the naked eye, and the error is also greater
In addition, the current technology cannot evaluate the flow of the photoresist after baking and the quality of the microlens array

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Monitoring marking layout for microlens baking process
  • Monitoring marking layout for microlens baking process
  • Monitoring marking layout for microlens baking process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Please refer to FIG. 5 , which shows the layout of the monitoring marks and the top view of the microlens array for checking the baked state of the microlenses according to the preferred embodiment of the present invention. As shown in FIG. 5 , the microlens array 20 is formed in the active circuit area 101 with a plurality of unbaked photoresist blocks 42 . In the present invention, the monitoring mark layout 100 for checking the baked state of the microlens can be formed in the scribe area 102 and defined simultaneously with the photoresist block 42 . The size of the layout shown in the figure is for reference only.

[0033] According to this preferred embodiment, the monitoring mark layout 100 for checking the baked state of the microlens can be a U-shaped pattern, including two vertical line patterns 110 and 120 arranged in parallel to each other, and a horizontal line pattern 130 connecting the aforementioned two vertical lines. Line patterns 110 and 120 . The ver...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to a monitoring marking layout for microlens baking process. Wherein, it comprises: two vertical-line pattern paralleled with each other, and one horizontal-line pattern connected to the vertical to define a pointer path and fluidize the vertical pattern to lead the horizontal pattern fusing along the path and forming design; then, uses the design to decide whether there once a roasting process to the microlens.

Description

technical field [0001] The invention relates to the manufacture of microlenses, in particular to a monitoring mark for the baking process of the microlenses, which is made on the cutting line and can be used to evaluate whether the microlens array has been baked and the quality of the baking. Background technique [0002] As known to those in the industry, microlens technology has been widely used in many optoelectronic products currently on the market, such as digital cameras and digital video cameras. The purpose of using the microlens is to control the direction of the light, so that the light can be gathered in the sensing area of ​​the light sensing chip. [0003] A digital camera usually includes a stacked color filter array (CFA) and a charge-coupled device (CCD) or complementary metal oxide semiconductor (CMOS) image sensor, wherein the color filter array includes three (R / G / B or above staggered filter channels, each filter channel only allows light of a specific f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02B3/00G03F7/20
Inventor 刘恩廷陈建豪林欣蔚周德瑜
Owner UNITED MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com