Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board, connector assembly and cable harness

Active Publication Date: 2019-06-27
JAPAN AVIATION ELECTRONICS IND LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a circuit board that reduces skew (when signals are distorted) and minimizes deterioration of differential to common-mode conversion. This is achieved by preventing electrical interaction between differential traces at a bending region where distortion might occur. The circuit board has differential traces with equal lengths, which reduces skew. Additionally, a ground conductor portion is arranged between the inner and outer trace portions to prevent electrical interaction and minimize deterioration of differential to common-mode conversion. The circuit board design reduces skew occurrence and improves differential to common-mode conversion.

Problems solved by technology

Accordingly, the cable harness having this structure is unfavorable.
Accordingly, skew occurs between a differential signal pair which passes through the modified differential traces, and thereby a transmission error occurs.
However, the remodeled shape of the inner trace distorts differential signals to cause unnecessary mode conversion where some of differential-mode signals are converted to common-mode signals.
Specifically, the remodeled differential traces have a drawback to cause differential to common-mode conversion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board, connector assembly and cable harness
  • Circuit board, connector assembly and cable harness
  • Circuit board, connector assembly and cable harness

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024]As shown in FIG. 1, a cable harness 10 according to an embodiment of the present invention comprises a connector assembly 700 and a cable 600. The cable 600 functions as a second connecting object 600. Although the cable 600 shown in FIG. 1 is simply illustrated as a plurality of insulated single wires, an actual cable 600 is a multi-conductor cable. Specifically, the actual cable 600 comprises a plurality of insulated single wires, which are bundled together, and an outer cover covering the bundled insulated single wires.

[0025]As shown in FIG. 1, the connector assembly 700 of the present embodiment comprises a connector 500 and a circuit board 100. The connector 500 functions as a first connecting object 500.

[0026]Referring to FIG. 1, the connector 500 of the present embodiment is mateable with a mating connector (not shown) along a mating direction. In the present embodiment, the mating direction is an X-direction. As shown in FIG. 1, the connector 500 of the present embodim...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is based on and claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. JP2017-247425 filed Dec. 25, 2017, the contents of which are incorporated herein in their entireties by reference.BACKGROUND OF THE INVENTION[0002]This invention relates to a circuit board, a connector assembly and a cable harness.[0003]Referring to FIG. 7, JP-A 2004-14800 (Patent Document 1) discloses a circuit board 900 on which a pair of differential traces 920 is formed. The differential traces 920 have a pair of first trace portions 921, a pair of second trace portions 928 and a coupling portion 930. The first trace portions 921, the coupling portion 930 and the second trace portions 928 are coupled in this order. The coupling portion 930 has a pair of first coupling portions 932, a pair of third trace portions 933, a pair of through holes 934, a pair of fourth trace portions 936 and a pair of second coupling portions 937. The co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02
CPCH05K1/0222H05K1/0228H01R12/53H01R12/722H05K2201/09027H05K2201/09227H05K2201/09236H05K2201/09272H05K2201/09618H05K1/0245H05K1/0218H01R13/6471H01R24/60H05K1/0248H05K1/117H05K2201/10356H05K2201/09672
Inventor TODA, KENTARO
Owner JAPAN AVIATION ELECTRONICS IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products