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Method for electrolytic surface modification of flat metal workpieces in copper-sulfate treatment liquid containing sulfate-metallates

Inactive Publication Date: 2016-11-03
SCHLENK METALLFOLIEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent aims to provide a method for improving adhesion to metal surfaces, particularly in sensitive and challenging bond systems. By using as few components as possible and depositing a copper layer doped with rare earth elements, the method can minimize the release of disruptive substances and increase the adhesive strength of flat metal workpieces. The technical effects of this patent are improved adhesion to metal surfaces and a more robust and reliable bonding mechanism.

Problems solved by technology

The technical difficulties of the methods used—degreasing, electrolytic cleaning, pickling, coating—consist in the insufficiently uniform edging of the surface of foils and strips.
However, for applications in which good adhesion to another material is required, a smooth surface may be undesirable.
If this is not or is not sufficiently the case, the adhesion deteriorates.
Thus, poor adhesion between a metal surface and the same or a different material, for example a lacquer layer, a paint layer or an adhesive can lead to products which are of inferior quality or even unusable.
However, anodizing is limited to a few metal materials, such as for example aluminium, titanium and alloys thereof.
For example, through the length of the aggregates, the adhesive bond is substantially dependent on the flow behaviour of the plastics to be pressed on, in particular when the flow behaviour is so poor that the plastic does not reach the base of the treatment and only undercuts form on the tips of the aggregates.
Even if such an adhesive bond is sufficiently good, there remain cavities in the bond at the base of the conventional aggregates of the treatment, into which aggressive chemicals can penetrate and can damage or destroy the adhesive bond through corrosion.

Method used

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  • Method for electrolytic surface modification of flat metal workpieces in copper-sulfate treatment liquid containing sulfate-metallates
  • Method for electrolytic surface modification of flat metal workpieces in copper-sulfate treatment liquid containing sulfate-metallates
  • Method for electrolytic surface modification of flat metal workpieces in copper-sulfate treatment liquid containing sulfate-metallates

Examples

Experimental program
Comparison scheme
Effect test

example 1

Copper Deposition on Copper Foil by Means of a Continuous Foil Installation Using Different Sulphuric Acid Copper Electrolytes with or without Addition of La Conducting Salt

[0112]A copper foil with a thickness of 0.035 mm and a width of 300 mm in the hard-as-rolled structural state was first subjected to a pre-treatment which comprised the following steps in the stated sequence:[0113]Degreasing: Immersion pass with electrolytic support, 45° C., alkaline cleaning agent[0114]Rinse: Water, immersion pass, 45° C.[0115]Pickling: Sulphuric acid 4% in water, immersion pass, 30-35° C.[0116]Rinse: Water, immersion pass, room temperature[0117]Rinse: Water, immersion pass, room temperature

[0118]The copper foil pre-treated in this way was then surface-modified in the described continuous foil installation using the electrolytes of Table 4 (Electrolyte 0, Electrolyte 1, Electrolyte 2, Electrolyte 3) and with the following method parameters:

[0119]Strip speed: 1 m / min.,

[0120]Average current streng...

example 2

Incorporation of Rare Earth Elements (REE) into the Aggregates on the Surface of Copper Foil Modified with REE-Cu Electrolytes

[0134]A copper foil with a thickness of 0.035 mm and a width of 300 mm in the hard-as-rolled structural state was first of all subjected to a pre-treatment which comprised the following steps in the stated sequence:[0135]Pre-cleaning: Purax 6029PUS, 40 g / l, 60° C., currentless, 10 s.[0136]Rinse: Water[0137]Precision cleaning: Velocit 1127M, 25 g / l, 60° C., currentless, 10 s.[0138]Rinse: Water[0139]Etching / pickling: Sulphuric acid (7% in water), 25° C.-35° C.[0140]Rinse: Water

[0141]The copper foil pre-treated in this way was then surface-modified in the described static electrolysis arrangement using Electrolyte 1 and Electrolyte 2 at room temperature with a charge density of 541 C / dm2:

[0142]After passing through the electrolysis apparatus, the surface-modified copper foil was subjected to an after-treatment which comprised the following steps in the stated se...

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Abstract

The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the use of said metal workpieces as substrates for the formation of secure adhesive bonds comprising a plurality of materials.

Description

[0001]The present invention relates to a method for the electrolytic surface modification of a flat metal workpiece by deposition of copper aggregates. The invention further relates to the flat metal workpieces produced with this method and to the use of the metal workpieces as substrate for the formation of strong adhesive bonds with a plurality of materials.[0002]The production of a large and rough surface is regarded as a prerequisite for a binder-free pressing of surfaces made of different materials. Depending on the combination of materials, the surfaces are first of all cleaned and then structured. Structuring is effected in the case of metal-metal bonds by dry brushing or grinding. In the case of metal-plastic bonds, which are generally produced by extruding a plastic onto a metal surface, the metal surface is pre-treated, e.g. by conversion, such as phosphating, chromating among other things, or the metal surface is modified by deposition of a deeply structured (“rough”) sur...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/06
CPCC25D7/0628C25D3/38C25D3/58C25D5/34C25D7/0664C25D7/0692C25F7/00
Inventor DISTELRATH, FABIANBOOZ, THOMASSEIDEL, ANDREAS
Owner SCHLENK METALLFOLIEN
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