Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Process for forming high-resistance slabs or tiles, intended for covering internal or external floors or walls

a technology of high-resistance slabs and tiles, applied in the direction of construction, transportation and packaging, building material handling, etc., can solve the problems of affecting the quality of the product, affecting the service life of the product, and not being very resistant to cracking,

Inactive Publication Date: 2013-11-07
PAGANELLI MARIANO
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

Modern ceramic tiles are very durable and can be installed on a rigid support to prevent deformation. However, there is a demand for a ceramic tile floor that can be installed without being cemented to the floor and by inexperienced personnel. The patent describes a new technology for this demand.

Problems solved by technology

However, ceramic material is intrinsically fragile, so that ceramic tiles, though exhibiting very high load value qualities, are by their nature not very resistant to impacts, as the mechanism propagating the rupture thereof is typical of hard-but-fragile materials: when subjected to a stress they rapidly reach breaking limit, even where the strain is very small.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Process for forming high-resistance slabs or tiles, intended for covering internal or external floors or walls
  • Process for forming high-resistance slabs or tiles, intended for covering internal or external floors or walls

Examples

Experimental program
Comparison scheme
Effect test

example no 1

[0035]An example of this invention relates to the application to the lower surface of the ceramic slab or tile of a galvanized steel sheet having a modulus of elasticity of 200 Gpa and being 0.5 mm thick, using as a glue a polyurethane resin in a heated die at 70° C. The die is used to maintain the ceramic tile and the galvanized steel sheet positioned in relation to one another. Once the resin has completed hardening the product can be extracted from the die and subsequent cooling thereof to ambient temperature of 20-30° C. leads to a state of compression of the lower surface which enormously increases resistance to impacts thereof.

example no 2

[0036]By way of instance, consider the following example in order to provide a quantification of the results achievable with the process of the invention applied to a normal vitrified stoneware tile, format 60×60 cm having a thickness of 12 mm, water absorbance of 0.012%, a thermal expansion coefficient α(20-100)=7.5×10−6 K−1 and fracture strength 55 MPa. A tile of this type, when not glued to the floor, if struck by a steel ball weighing 510 grams from a height of 100 mm shatters into many shards. If the same tile is glued to the floor using a high-resistance glue (Mapei Kerabond) it can withstand an impact by the same ball from a height of 800 mm (Certifications et classements des produits du batiment—Revetementes de sol ceramiques—Cahiers du CSTB, cahier 3503 annexe 6 choc lourd—Janvier 2005). Beyond this height, the tile glued to the floor begins to dent, but does not break into fragments.

[0037]The same type of tile is glued under heating at 50° C. with a heat-fusible reactive p...

example no 3

[0038]By way of example of application of the invention, consider the use of a ceramic slab or tile 1 having a 60×60 cm format with a thickness of only 3 mm made of unglazed vitrified stoneware. This tile has a water absorption of 0.01%, a thermal expansion coefficient of α(20-100)=7.2×10−6 K−1 and a fracture strength of 60 Mpa. When rested on the floor, it shatters if stuck by the steel ball weighing 510 grams which falls from a height of 50 millimeters. If the tile is glued according to the present invention on the floor using a high-resistance adhesive it can withstand an impact of a steel ball weighing 510 grams falling from a height of 800 mm. If the ball falls from greater heights the tile dents, i.e. is damaged by crushing.

[0039]The same type of tile is then, according to the process of the present invention, glued under heating at a temperature of 50° C. on an AISI 430 stainless steel sheet having a thermal expansion coefficient of α(20-100)=10×10−6 K−1, a modulus of elastic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
temperatureaaaaaaaaaa
heightaaaaaaaaaa
weightaaaaaaaaaa
Login to View More

Abstract

The process includes the following stages: arranging a slab or tile exhibiting an in-view surface; arranging at least a slim support slab or support plate having a characteristic of possessing a thermal expansion coefficient which is greater than a thermal expansion coefficient of the slab or tile, the slim support slab or support plate exhibiting effective properties of tenacity and resistance to easy breakage thereof; gluing under heating the slab or tile onto the slim support slab or support plate, or vice versa, using a suitable glue for adhering to surfaces thereof to be glued; leaving an assembly thus obtained to cool down to an ambient temperature such that owing to a different thermal expansion coefficient (contraction), the slim support slab or support plate induces on the slab or tile, to which it is solidly glued, a state of compression starting from a lower surface thereof which is opposite the in-view surface.

Description

FIELD OF THE INVENTION[0001]The invention relates to a process for forming high-resistance slabs or tiles, intended for covering internal or external floors or walls.SUMMARY OF THE INVENTION[0002]Specifically, though not exclusively, it is usefully applied in the sector of ceramic tiles which have been successful in the market for floorings and coverings in residential buildings and public spaces thanks to their characteristics of durability and hygiene, naturally apart from the infinite possibilities of decoration they afford.[0003]Modern known tiles are characterized by a high level of mechanical and chemical resistance, as well as resistance to surface abrasion, and are also easy to clean. For these reasons they have become very widely used.[0004]However, ceramic material is intrinsically fragile, so that ceramic tiles, though exhibiting very high load value qualities, are by their nature not very resistant to impacts, as the mechanism propagating the rupture thereof is typical o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): E04F15/08
CPCE04F15/08E04F13/142Y10T156/1089Y10T428/166
Inventor PAGANELLI, MARIANO
Owner PAGANELLI MARIANO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com