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Vacuum Pumped Liquid Cooling System for Computers

a liquid cooling system and vacuum pump technology, applied in indirect heat exchangers, lighting and heating apparatus, instruments, etc., can solve the problem of limiting the delta pressure available to each heat exchanger, and achieve the effect of reducing the volume of water, increasing the water flow and turbulence, and reducing the amount of water

Inactive Publication Date: 2011-10-20
CHILLDYNE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The patent describes a system for cooling computer servers using a minimal amount of water in an efficient and reliable manner. The system includes a cooling tower, water distribution system, and high performance heat exchangers. The system is designed to provide negative pressure to remove any air that may enter the system. The system also includes pressure regulators to maintain a desired pressure across the heat exchanger. The system may also have a vacuum reservoir and air release system to remove any accumulation of air. The system is designed to remove all water from the system during the disconnection process. The technical effects of the system include efficient and reliable cooling for computer servers, reduced water usage, and improved air-cooled heat exchangers."

Problems solved by technology

This limits the available delta pressure available to each heat exchanger to the difference between the vapor pressure of the warmest water within the system and the local absolute pressures.

Method used

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  • Vacuum Pumped Liquid Cooling System for Computers
  • Vacuum Pumped Liquid Cooling System for Computers
  • Vacuum Pumped Liquid Cooling System for Computers

Examples

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Embodiment Construction

[0028]The following detailed description presents a description of certain example embodiments of the present invention. In this description, reference is made to the drawings wherein like parts are designated with like numerals throughout.

[0029]Referring to the example embodiment shown in FIG. 1, a supply of liquid coolant such as water 12 is maintained at a low temperature by the evaporation of the water as it flows out of nozzle 13. The humid air flows out due to fan 14 in cooling tower 11. Due to the low pressure in the reservoir 6, the water flows through a filter 9, and check valve 18 and a supply pipe 5, through a pressure regulator 3, through another check valve with a cracking pressure of approximately 1 inch HG, through and vacuum accumulator 17 and then through a fluid connector 2, to the computer with internal heat exchanger 1. The water then receives heat from the internal electronic components in the computer and flows out through the connector to an extraction pipe 4 ...

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PUM

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Abstract

A reliable, leak tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. The system provides both air and liquid cooling so that if the liquid cooling system does not provide adequate cooling, the air cooling system will be automatically activated. A connector system is provided to automatically evacuate the liquid from the heat exchangers before they are disconnected.

Description

BACKGROUND OF THE DISCLOSUREBrief Description of the Related Art[0001]Arrays of electronic computers, such as are found in data centers, generate a great deal of heat. A typical CPU puts out over 100 watts and has a maximum case temperature of about 60 C. A typical rack of 88 CPUs may put out 9 Kw. The maximum outside temperature at a hot urban location might be 45 C, so the heat flow goes with the gradient. Theoretically, no refrigeration should be required, yet the standard way to keep data centers cool is to use vapor compression refrigeration systems at least part of the time. These systems often use more power that the computers themselves. These systems use air as the heat transfer medium, and it is due to the low heat capacity and thermal conductivity of air that refrigeration must be used to overcome the thermal resistance of multiple air heat exchangers. Some operators use evaporation of water to cool water-to-air heat exchangers which then in turn cool computers, and this ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/00
CPCF28D7/028F28D2021/0019F28F1/16F28F7/02H05K7/20836H05K7/20272H05K7/2079F28F2215/00G06F1/20
Inventor HARRINGTON, STEVE
Owner CHILLDYNE
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