Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Microelectrode array architecture

a technology of array architecture and microelectrode, which is applied in the field of microelectrode array architecture, can solve the problems of high cost of semiconductor manufacturing techniques, difficult access to semiconductor foundries, so as to reduce labor and cost, reduce energy consumption, and relieve loc designers

Inactive Publication Date: 2011-10-13
SPARKLE POWER
View PDF1 Cites 77 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The patent describes a device that uses microelectrodes to manipulate droplets in a microfluidic system. The device includes a microelectrode array with multiple microelectrodes and a system control block for programming the device. The system control block includes a controller block for providing the processor unit, memory spaces, and software programming capabilities. The device also includes a droplet manipulation unit for programming the microelectrodes to activate or deactivate them. The device can be used for various applications such as microelectrode array programming, lab-on-chip functions, and permanent display designs. The invention provides a flexible and programmable tool for manipulating droplets in microfluidic systems."

Problems solved by technology

These techniques offer many advantages in the implementation of the digital microfluidics paradigm as described above but current fabrication techniques to produce these microfluidic chips still depend on rather complex and expensive manufacturing techniques.
In addition to higher cost for semiconductor manufacturing techniques, semiconductor foundries are not easily accessible.
Unfortunately, the conventional microfluidic systems employing microfluidic technique built to date are still highly specialized to particular applications.
The progress in microfluidic system development (including both continuous-flow and digital microfluidic devices) has been hampered by the absence of standard commercial components.
Also, due to the fixed layouts of current microfluidic chips, a new chip design is required for each application, making it expensive to develop new applications.
Furthermore, many of these devices are fabricated using expensive microfabrication techniques derived from semiconductor integrated circuit manufacturing.
As a result, applications for microfluidic devices are expanding relatively slowly due to the cost and effort required to develop new devices for each specific application.
Although batch fabrication allows microfabricated devices to be inexpensive when mass-produced, the development of new devices can be prohibitively expensive and time consuming due to high prototyping costs and long turn-around time associated with fabrication techniques.
Also, as more bioassays are executed concurrently on a LOC as well as more sophisticated control for resource management, system integration and design complexity are expected to increase dramatically.
The difficulty with a hierarchical approach is the lack of standard fabrication technologies and digital microfluidic device simulation libraries, which make the hierarchical design approach difficult to implement.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microelectrode array architecture
  • Microelectrode array architecture
  • Microelectrode array architecture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0096]Microelectrode Array Architecture can be applied to other digital microfluidic technologies such as dielectrophoresis (DEP) based technologies but for the discussions below, EWOD technology will be used to illustrate various embodiments of the present invention.

[0097]EWOD based devices are commonly used to manipulate droplets by using the interfacial tension gradient across the gap between the adjacent electrodes to actuate the droplets. The designs of electrodes include the desired shapes, sizes of each of the electrode and the gaps between each of the two electrodes. In the droplet manipulation of EWOD based LOC layout design, the droplet pathways generally are composed of a plurality of electrodes that connect different areas of the design.

[0098]A conventional electrowetting microactuator mechanism (in small scale for illustration purposes only) is illustrated in FIG. 1A. EWOD-based digital microfluidic device consists of two parallel glass plates 120 and 121, respectively....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
driving voltageaaaaaaaaaa
velocityaaaaaaaaaa
heightaaaaaaaaaa
Login to View More

Abstract

Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application claims benefit of priority under 35 U.S.C. 119(e) to: U.S. Patent Application 61 / 312,240, entitled “Field-Programmable Lab-on-a-Chip and Droplet Manipulations Based on EWOD Micro-Electrode Array Architecture” and filed Mar. 9, 2010; U.S. Patent Application 61 / 312,242, entitled “Droplet Manipulations on EWOD-Based Microelectrode Array Architecture” and filed Mar. 9, 2010; U.S. Patent Application 61 / 312,244, entitled “Micro-Electrode Array Architecture” and filed Mar. 10, 2010. The foregoing applications are hereby incorporated by reference into the present application in their entireties.[0002]The present application also incorporates by reference in its entirety co-pending U.S. patent application Ser. No. ______, entitled “Droplet Manipulations on EWOD Microelectrode Array Architecture”, and filed on the same date as the present application, namely, Feb. 17, 2011; co-pending U.S. patent application Ser. No. ______,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B81B7/04G06F17/50C25B15/00
CPCB01L3/502792B01L2300/0816B01L2400/0427B01L2300/161B01L2300/089
Inventor WANG, GARY CHORNG-JYHHO, CHING YENHWANG, WEN JANGWANG, WILSON WEN-FU
Owner SPARKLE POWER
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products