Method and system for communicating via leaky wave antennas within a flip-chip bonded structure

Abstract

Methods and systems for communicating via leaky wave antennas (LWAs) within a flip-chip bonded structure are disclosed and may include communicating RF signals in a wireless device including one or more LWAs between a plurality of support structures, the structures being coupled via flip-chip bonding. Low-frequency signals may be communicated via flip-chip bonding contacts. The RF signals may be communicated perpendicular to a surface and / or at a desired angle from the surface of the structures, which may include at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board. The LWAs may include microstrip and / or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The low-frequency signals may include DC bias voltages. The RF signals may be communicated from a single LWA to a plurality of LWAs.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS / INCORPORATION BY REFERENCE[0001]This application makes reference to, claims the benefit from, and claims priority to U.S. Provisional Application Ser. No. 61 / 246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61 / 185,245 filed on Jun. 9, 2009.[0002]This application also makes reference to:[0003]U.S. patent application Ser. No. 12 / 650,212 filed on Dec. 30, 2009;[0004]U.S. patent application Ser. No. 12 / 650,295 filed on Dec. 30, 2009;[0005]U.S. patent application Ser. No. 12 / 650,277 filed on Dec. 30, 2009;[0006]U.S. patent application Ser. No. 12 / 650,192 filed on Dec. 30, 2009;[0007]U.S. patent application Ser. No. 12 / 650,224 filed on Dec. 30, 2009;[0008]U.S. patent application Ser. No. 12 / 650,176 filed on Dec. 30, 2009;[0009]U.S. patent application Ser. No. 12 / 650,246 filed on Dec. 30, 2009;[0010]U.S. patent application Ser. No. 12 / 650,292 filed on Dec. 30, 2009;[0011]U.S. patent application Ser. No. 12 / 650,324 filed on De...

AI Technical Summary

Benefits of technology

[0028]A system and / or method for communicating via leaky wave antennas within a flip-chip bonded structure as shown in and / or described in connection with at least one of the figures, as set forth more completely in the claims.

Problems solved by technology

Additionally, transmit and / or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices.

Moreover, in some conventional communication systems, transmitters and / or receivers are often power inefficient in comparison to other blocks of the portable communication devices.

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