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Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same

a carrier member and carrier technology, applied in the direction of printed circuit manufacturing, printed circuit aspects, conductive pattern formation, etc., can solve the problems of reducing the reliability of circuits, reducing the size and thickness of substrates, and reducing the area of circuits, so as to achieve high reliability

Inactive Publication Date: 2008-10-30
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012]In a first aspect, the present invention provides a carrier member for transmitting circuits, which can be used to transmit circuit patterns, having protrusions only in the predetermined portion thereof, to a resin insulation layer and to embed them therein without damaging a circuit.

Problems solved by technology

In order to satisfy the requirement, the package substrates for use in mobile applications must have very high density structures than those of conventional ones, which incurs the technical problem of decreasing the size and thickness of the substrates.
However, as shown in the right side of FIG. 6, when a resin insulation layer 611 is flash-etched to remove a copper seed layer 612 formed thereon, there is a decrease in circuit reliability, such as a short circuit, not only because an electrolytic plated layer 613, as well as the copper seed layer 612, is etched to some extent such that the circuit size is negatively influenced (D1), but also because the lower portion of the circuit is excessively etched such that the area of the circuit is reduced (D2).

Method used

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  • Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
  • Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
  • Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same

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Embodiment Construction

[0040]Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0041]Reference now should be made to the drawings, in which the same reference numerals are used throughout the different drawings to designate the same or similar components.

[0042]FIG. 1 is a schematic sectional view showing a structure of a coreless printed circuit board according to an embodiment of the present invention.

[0043]The coreless printed circuit board according to an embodiment of the present invention, which is a thin structure with circuits embedded in resin, can be used as a core structure of a high-density substrate.

[0044]Referring to FIG. 1, the coreless printed circuit board 100 includes a resin insulation layer 101; circuit patterns 102 and 104, including lands 103 and 105, the surfaces of which are exposed, and which are embedded in respective sides of the resin insulation layer 101; and a via 106 contacting the lands 103 and 105...

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Abstract

Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2007-0042002, filed on Apr. 30, 2007, entitled “Carrier Member for Transmitting Circuits, Coreless Printed Circuit Board Using said Carrier Member, and Methods of Manufacturing the Same,” which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a carrier member for transmitting circuits, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board. More particularly, the present invention relates to a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower...

Claims

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Application Information

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IPC IPC(8): H05K3/10H05K1/00H05K1/11
CPCH05K3/205H05K3/383H05K3/384H05K3/428Y10T29/49155H05K3/4658H05K2201/0394H05K2201/09563H05K2203/1536H05K3/4602H05K3/00
Inventor KANG, MYUNG SAMMIN, BYOUNG YOULYOO, JE GWANGPARK, JUNG HYUNRYU, CHANG SUPAHN, JIN YONG
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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