High throughput serial wafer handling end station

Abstract

An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

Description

FIELD OF THE INVENTION[0001]The present invention relates generally to workpiece processing systems and methods for processing workpieces, and more specifically to a system and method for handling workpieces wherein throughput is maximized.BACKGROUND OF THE INVENTION[0002]In semiconductor processing, many operations may be performed on a single workpiece or semiconductor wafer. In general, each processing operation on a workpiece is typically performed in a particular order, wherein each operation waits until completion of a preceding operation, thus affecting the time at which the workpiece will become available for a subsequent processing step. Tool productivity or throughput for relatively short processes performed under vacuum, such as ion implantation, can be severely limited if the process flow leading to the processing location is interrupted by sequential events associated with such processing. For example, operations such as an exchange of workpieces between transport carri...

AI Technical Summary

Benefits of technology

[0008]The present invention overcomes the limitations of the prior art by providing a system, apparatus, and method for transferring workpieces between atmospheric and vacuum environments, while maximizing throughput and minimizing costs of ownership associated with the systems. More particularly, the present invention provides a system and method for reducing a cost of ownership of the system by minimizing an idle time, or the amount of time a processing system is operating but not producing a processed workpiece.

Problems solved by technology

Tool productivity or throughput for relatively short processes performed under vacuum, such as ion implantation, can be severely limited if the process flow leading to the processing location is interrupted by sequential events associated with such processing.

A mechanism known as an aligner is used for such an alignment step, where each workpiece is aligned serially, thus potentially decreasing throughput.

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