Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material

Abstract

Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and / or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and / or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

Description

RELATED APPLICATIONS [0001] This application claims benefit of U.S. Provisional Patent Application Nos. 60 / 534,159, and 60 / 534,183, both filed Dec. 31, 2003. Each of these referenced applications is incorporated herein by reference.FIELD OF THE INVENTION [0002] The present invention relates generally to the field of electrochemical fabrication and the associated formation of three-dimensional structures (e.g. microscale or mesoscale structures). In particular, it relates to electrochemical fabrication processes that utilize diamond machining during the planarization of deposited materials. BACKGROUND OF THE INVENTION [0003] A technique for forming three-dimensional structures (e.g. parts, components, devices, and the like) from a plurality of adhered layers was invented by Adam L. Cohen and is known as Electrochemical Fabrication. It is being commercially pursued by Microfabrica Inc. (formerly MEMGen® Corporation) of Burbank, Calif. under the name EFAB™. This technique was described...

AI Technical Summary

Benefits of technology

[0033] It is an object of some embodiments of the invention to provide electrochemical fabrication processes with enhanced capabilities.

[0034] It is an object of some embodiments of the invention to provide more rapid planarization of deposited materials during multi-layer electrochemical fabrication of structures.

[0035] It is an object of some embodiments of the invention to provide enhanced and / or more reliable surface finish of planarized materials.

[0036] It is an object of some embodiments of the invention to provide enhanced electrochemical fabrication embodiments that can reliably and efficient make use of fly cutting to planarize deposited materials.

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

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