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Probe end cleaning sheet

a technology of end-of-probe cleaning and end-of-probe, which is applied in the direction of measuring lead/probe, semiconductor/solid-state device testing/measurement, manufacturing tools, etc., can solve the problems of poor electrical contact and inability to measure accurate characteristics

Inactive Publication Date: 2002-03-07
NIHON DENSHIZAIRYO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unless such foreign matter is removed from the end of the probe, faulty conduction occurs between the probe and the pad, and electric contact is worsened, and accurate characteristics cannot be measured.

Method used

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Examples

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embodiments

[0026] FIG. 1 is a schematic explanatory diagram of cleaning of a probe using a probe end cleaning sheet according to an embodiment of the invention, FIG. 2 is a drawing of the probe end cleaning sheet in the embodiment of the invention, (A) being a schematic magnified sectional view, (B) being a schematic plan view, FIG. 3 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention, FIG. 4 is a drawing of a probe end cleaning sheet in other embodiment of the invention, (A) being a schematic magnified sectional view, (B) being a schematic plan view, FIG. 5 is a schematic structural view for explaining cleaning of the probe using the probe end cleaning sheet in the embodiment of the invention, and FIG. 6 is a schematic explanatory diagram showing the shape of the end of the probe cleaned by the probe end cleaning sheet in the embodiment of the invention. In the drawings, meanwhile, the ratio of dimensions o...

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Abstract

To remove foreign matter without deforming the end of a probe, and prevent new foreign matter from adhering to the end of a probe. A probe end cleaning sheet for removing foreign matter adhered to the end of a probe 211, comprising a cleaning thin film 110 having fine abrasive powder applied on the surface, an elastic sheet 120 provided in a lower layer of the cleaning thin film 110 and having an elasticity, and a board 130 provided in a lower layer of the elastic sheet 120, in which the cleaning thin film 110 is made of a material which is dented when the end of the probe 211 is pressed with a specified load but is not torn by the end of the probe 211, and the elastic sheet 120 is made of a material which is dented in the pressed portion by the end of the probe 211 when the end of the probe 211 is pressed to the cleaning thin film 110 with the specified load.

Description

DETAILED DESCRIPTION OF THE INVENTION[0001] 1. Technical Field of the Invention[0002] The invention relates to a probe end cleaning sheet for removing foreign matter adhered to the end of a probe.[0003] 2. Prior Art[0004] The probe of a probe card for measuring various electric properties of semiconductor chips formed on a semiconductor wafer is pressed tight (overdriven) against the pad of semiconductor chips. As a result, foreign matter such as powder of aluminum scraped off from the pad is adhered. This foreign matter is particularly likely to be adhered to the end of the probe when the pad is composed of an alloy of aluminum and copper. Unless such foreign matter is removed from the end of the probe, faulty conduction occurs between the probe and the pad, and electric contact is worsened, and accurate characteristics cannot be measured. If the probe is left over for a long period, the contact resistance tends to be higher.[0005] To solve such problems, hitherto, the foreign matt...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B29/04B24D3/22G01R1/06B24D11/00G01R31/28H01L21/66
CPCB24B29/04B24D3/22B24D11/001
Inventor OKUBO, MASAONISHIZAKI, SHUNICHIROKOZAKI, SHINICHIROSAKATA, TERUHISA
Owner NIHON DENSHIZAIRYO
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