Electronic carrier plate and packaging structure thereof

Abstract

The invention relates to an electric carrier, wherein it comprises main body, several welding pads on the face of main body, and a protective layer covering the main body; the protective layer has one cut between two couple welding pad, while at least three side faces are exposed from the welding pads; the protective layer has at least one independent left part between the welding pads; the electric element can connect the left part, to connect the couple welding pads via conductor; the electric element and the face of main body have non-dead-corner channel; insulated resin covers the electric element to be distributed at the low side of electric element and in the open, to cover at least three side faces of welding pad, to avoid generating gas hole at low side of electric element, and avoid bad connection between welding pads or between conductors of nearby electric elements.

Description

technical field [0001] The present invention relates to an electronic carrier board and a structural structure, in particular to an electronic carrier board and a structural structure applied in surface mount technology (Surface Mounted Technology, SMT). Background technique [0002] With the advancement of integrated circuit production technology, the design and production of electronic components continue to develop towards the trend of miniaturization, and because they have larger-scale and highly integrated electronic circuits, the product functions are also more complete. [0003] In this case, the electronic components that are traditionally placed using Through Hole Technology (THT) cannot be further reduced in size, thus occupying a printed circuit board (Printed Circuit Board; PCB), a circuit board (circuit board) ) or substrate (substrate) and other electronic carrier boards have a lot of space, plus the plug-in assembly technology needs to drill holes on the elect...

AI Technical Summary

Problems solved by technology

[0012] Please refer to FIG. 4B. In US Patent No. 2005 / 0253231, when the insulating resin 47 (as shown by the arrow) flows into the two openings 430 formed by the barrier strip 431 and the exposed solder pad 42 When the flow channel is 4300, the space is extremely small, which can easily cause turbulent flow at the corner of the flow channel, and even lead to the generation of air cavity V, which will increase the probability of gas explosion in the subsequent thermal process environment

[0013] Furthermore, in the technologies disclosed in the above-mentioned U.S. Patent No. 6,521,997 and No. 2005 / 0253231, in the face of the influence of the configuration of adjacent passive components, they cannot provide an effective solution to the problem that the solder paste between adjacent passive components may pass through the surface of the substrate and solder rejection. Inter-diffusion, contact, etc. in the gaps between layers cause solder extrusion (solder extrusion), and even lead to short-circuit problems in adjacent passive components

[0014] To sum up, how to provide an electronic carrier board and its structure to avoid air holes, electrical bridging, and solder bumps caused by gaps between the electronic components and the electronic carrier board when electronic components are placed on it. The extension problem is actually a problem that the industry urgently needs to solve

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