Heat radiator

A technology of a heat sink and a heat sink, which is applied in cooling/ventilation/heating transformation, electrical components, electrical solid devices, etc., can solve the problems of inconvenient operation and laborious operation, and achieve the effect of convenient assembly and disassembly

Inactive Publication Date: 2007-05-16
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in order to fasten the hook portion of the fastener with the fastening portion of the fixed module, it is necessary to overcome the elastic recovery force of the fastener, and the operation is laborious. In addition, the fastening process is often completed with the help of tools, which is inconvenient to operate

Method used

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  • Heat radiator
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Embodiment Construction

[0015] Please refer to FIG. 1 , the heat dissipation device is used for dissipating heat generated by an electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink, and the heat sink includes a heat dissipation body 50 and a heat conductor 40 combined with the heat dissipation body 50 . The heat dissipation device further includes a fixing plate 30 matched with the heat conductor 40 , a buckle 20 and a fixing module 10 matched with the buckle 20 and the fixing plate 30 .

[0016] The fixing module 10 is a square frame, which is arranged on the circuit board around the electronic components. The fixing module 10 has an opening 110 for accommodating electronic components and first, second, third, and fourth sides 120 , 130 , 140 , and 150 surrounding the opening 110 . Four corners of the fixing module 10 extend downwards to define four fixing feet 160 for fixing the fixing module 10 to the circuit board. The second...

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Abstract

The related radiation device for electronic element comprises: a radiator with a radiation body and a combined heat-conductive body, a fixing module with bottom to prop the following first fixing arm, a fastener with a connection part with a prop part for rotating setting on the fixing module and an operation part, and a fixing plate combined with the heat-conductive body and arranged two fixing arms on ends. This invention is convenient to assembly and operates.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a fixing element for fixing the heat dissipation device to a heat-generating electronic component. 【Background technique】 [0002] As we all know, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the heat-generating electronic component from rising due to the accumulation of heat, thereby causing unstable operation, the electronic component usually needs to be equipped with a heat dissipation device to assist in heat dissipation. Usually, in order to closely fix the heat sink to the electronic component, additional fixing components are required. [0003] At present, one of the various heat dissipation devices used in the industry includes a heat sink, a fixing module arranged around the electronic components, and a fastener that cooperates with the fixing module to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40H05K7/20
CPCH01L2924/0002
Inventor 林宥成陈峰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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