Submount for light emitting/receiving device

Abstract

In a submount main body (1) composed of a single crystal silicon, a mounting surface (4) on which a light-emitting device (11) is mounted is composed of a (100)-oriented surface and the inner surface of a through hole (3) which is formed by anisotropic etching is parallel to the (110)-oriented surface. The light-emitting portion of the light-emitting device (11) is arranged to face a device-side opening (31) which opens into the mounting surface (4) of the submount main body (1). Consequently, heat generated in the light-emitting device (11) can be discharged to the outside more efficiently than the case where the light-emitting portion is arranged to face a side opposite to the submount side. Specifically, light from the light-emitting device (11) is reflected by a reflective surface formed on the surface of the through hole (3), and highly efficiently transmitted outside of the submount main body (1).

Description

technical field [0001] The present invention relates to a submount for optical transceiver elements that are used in optical communications and automobiles and require reduced power consumption and heat dissipation. Background technique [0002] In recent years, especially with the increase in luminance of LEDs (Light Emitting Diodes), high heat dissipation performance has been demanded for submounts on which the LEDs are mounted. Submounts with high heat dissipation performance include, for example, those using diamonds used in the above-mentioned optical communication system for long-distance transmission. The above-mentioned optical communication system for long-distance transmission is relatively expensive, so expensive components such as the above-mentioned diamond can be used. [0003] However, in lighting and vehicle equipment using a large number of high-intensity LEDs, and in optical communication systems for short-distance transmission with relatively low setup co...

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Problems solved by technology

[0007] However, in the case where the light guide body 103 is formed of a transparent material such as glass or transparent resin in order to improve the light transmission performance, the heat dissipation performance of the light emitting element 102 is poor due to relatively poor thermal conductivity.

Also, since translucent materials are more expensive than Si materials, etc., there is a problem that the price of submounts is high

On the other hand, when the above-mentioned light guide body 103 is produced cheaply by metal pressing method using metal material, it is easy to scratch the surface of the above-mentioned through hole, so it is difficult to obtain a good reflective surface, so it is difficult to obtain good light transmission performance. The problem

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