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Installation work management method, installation machine and preparation support method, installation assembly line

A technology for job management and installation machine, which is applied in the direction of assembling printed circuits, electrical components, and electrical components with electrical components, which can solve problems such as component shortages and errors, and inability to obtain production efficiency.

Active Publication Date: 2010-07-21
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Moreover, even when the component supply device is accurately installed at the specified position, unpredictable external disturbances such as component shortages and errors may occur, and the expected production efficiency may not be obtained, so it is also desired to improve this. question

Method used

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  • Installation work management method, installation machine and preparation support method, installation assembly line
  • Installation work management method, installation machine and preparation support method, installation assembly line
  • Installation work management method, installation machine and preparation support method, installation assembly line

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no. 1 Embodiment approach

[0099] Fig. 1 is a schematic side view of an installation line applicable to the present invention. As shown in Fig. 1, the installation line 90 includes a board loading machine 91, a printing press 92, multiple (3) mounting machines 10..., an inspection machine 93, and a reflow furnace from the upstream side to the downstream side of the production line. 94 and substrate unloading machine 95 and other equipment.

[0100] The substrate loading machine 91 is a device that stores a plurality of substrates and sequentially loads the substrates to the printer 92. The printer 92 is a device that applies the solder paste by printing in the substrate processing area that is carried in. The mounting machine 10... is a device that mounts electronic components on a predetermined position on a substrate. The inspection machine 93 is a device that inspects the mounting state of electronic components mounted on the substrate. The reflow furnace 94 is a device for soldering the substrate an...

no. 2 Embodiment approach

[0197] Next, a second embodiment according to the present invention will be explained. The basic structure of the mounting line applied to the second embodiment, the mounting machine included in the mounting line, and the functions of the mounting machine component supply unit are the same as those of the first embodiment (FIGS. 1 to 3 ), and therefore the description is omitted. Only the differences are explained in detail below.

[0198] In the mounting line 90 of the second embodiment, the mounting work of various components on the substrate to be produced is allocated to the component supply device mounted on any mounting machine of the mounting line 90. Then, for components that are not installed on any mounting machine of the installation line 90 among the required components, the operator is notified and prompted to install it on any mounting machine of the installation line 90.

[0199] According to this method of operation, if the component supply device for supplying req...

no. 3 Embodiment approach

[0256] Next, a third embodiment of the present invention will be explained. The basic structure of the mounting line applicable to the third embodiment, the mounting machine included in the mounting line, and the functions of the mounting machine component supply unit are the same as those of the first embodiment (FIGS. 1 to 3 ), so the description is omitted. In the following, only the differences will be described in detail.

[0257] The installation line 90 of the third embodiment is basically the same as that of the first embodiment. According to the disclosed optimization method, the installation machine 10 on which the installation work is allocated is determined, and the sequence of the initial production process is made to perform each installation. The sequence of the mounting work allocated on the mounting machine, based on this, corresponds to the configuration of the component supply device currently installed on any mounting machine of the mounting line 90, and the m...

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PUM

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Abstract

The present invention provides one kind of installation task managing method, installing machine, preparing and backup method and installation flow line. Among the installing machines, the current configurations of the element suppliers for different pieces of equipment and the configurations of the element suppliers the production programs of different installing machine are transferred mutually. Furthermore, the installation job designated to some installing machine may be transferred to some other one with the element suppliers for executing the installation job. In this way, correspondingto the current configurations of the element suppliers, the installing jobs for the base plate as the production object may be designated to different installing machines, and the preparing jobs on element suppliers, etc of the operator may be decreased.

Description

[0001] Technical area [0002] The present invention relates to a management method and the like for mounting work of mounting electronic components on a printed circuit board. Background technique [0003] Conventionally, as a mounting machine for mounting electronic components on a printed circuit board, there is a mounting machine that transfers and mounts electronic components such as ICs from a plurality of component supply devices to the board with a suction head. Furthermore, there is a method of connecting a plurality of such mounting machines to form a mounting assembly line, and distributing the mounting work of mounting electronic components on the substrate to each mounting machine. [0004] For the allocation of component mounting work to the settings of each mounting machine that constitutes this mounting line and the configuration of the component supply device in each mounting machine, various optimal methods have been proposed to improve production efficiency ( Refe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/08H05K3/32
Inventor 西城洋志小林一裕伊藤三郎
Owner YAMAHA MOTOR CO LTD
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