Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for printed circuit board power completeness simulation

A power integrity, printed circuit board technology, applied in the electronic field, can solve problems such as unusable models and information, no interface, inaccurate PI simulation results, etc., to reduce the system design cycle, reduce system design costs, and ensure accuracy sexual effect

Inactive Publication Date: 2006-11-08
HUAWEI TECH CO LTD
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In practical application, the above scheme has the following problems: the existing technical scheme is inaccurate for the PI simulation results of the third-party schematic diagram
[0011] The main reason for this situation is that the simulation tool in the existing technical solution has no interface with the third-party schematic diagram, and does not read the number (CODE) of the symbol in the third-party schematic diagram, so the model and parameters of the symbol cannot be accurately determined , and the accurate model and information of the symbols in the third-party schematic diagram in the external library cannot be used, and only the default model and parameters can be used, resulting in inaccurate PI simulation results

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for printed circuit board power completeness simulation
  • Method for printed circuit board power completeness simulation
  • Method for printed circuit board power completeness simulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0042] In order to illustrate the solution of the present invention more clearly, it will be described below in conjunction with the first preferred embodiment of the present invention. Wherein, the current PCB software used in the first preferred implementation mode is allegro software of cadence company.

[0043] The flow process of the PI simulation method of PCB according to the first preferred embodiment of the present invention is as follows: image 3 shown.

[0044] First enter step 310, modify the information related to the capacitor symbol in the third-party schematic diagram to make the number visible in the current PCB software. Each symbol in the present invention represents a device, such as a capacitor. In the first preferred embodiment of the pre...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention discloses a method for emulating the integrated power supply of a PCB, in which, accurate PI emulation to a PCB is carried out by a device attribute provided by a third party theoretical plot and related power integrality emulation software and the first attribute related to the device models and parameters in the third theoretical plot is added to the second attribute of the same plot symbol, only the second attribute of the theoretical plot symbol is preserved in the net list generated in the theoretical plot, after an emulation tool is called into the list, related models and parameters are presented to related devices based on the first attribute included in the second attribute, then a net list is generated in related supply integrality emulation software, finally, the net list is modified to be replaced to models and parameters assigned in the third party theoretical plot for further compiling and emulation and the parameters assigned in the third party theoretical plot can be the parameter S library.

Description

technical field [0001] The invention relates to electronic technology, in particular to the power integrity simulation technology of printed circuit boards. Background technique [0002] With the development of information technology, electronic devices are getting closer and closer to people's lives. PCB is an important part of most electronic devices. With the increasing complexity and performance of electronic devices, the density of PCBs and the frequency of related devices are increasing, and the challenges that engineers face in high-speed and high-density PCB design are also increasing. In addition to the well-known signal integrity (Signal Integrity, referred to as "SI") issues, power integrity (Power Integrity, referred to as "PI") is also a hot issue in high-speed and high-density PCBs. [0003] Compared with signal integrity, PI is a relatively new technology, mainly discussing the stability of power supply, which is considered to be one of the biggest challenge...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 毛忠宇张坤
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products