Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus for processing substrate

A substrate processing and substrate technology, applied in the field of substrate processing devices, can solve the problems of increasing the area of ​​cluster devices

Active Publication Date: 2006-10-04
SEMES CO LTD
View PDF0 Cites 46 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the number of processing chambers increases and the size of the substrate increases, the area occupied by the cluster device also increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus for processing substrate
  • Apparatus for processing substrate
  • Apparatus for processing substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] It will be understood that when it is stated that a component or layer is "on", "connected to" or "coupled to" another component or layer, it may be directly on the other component or layer. A layer may be on, directly connected to, or bonded to another element or layer, or there may be an intervening element or layer in between. In contrast, when it is stated that an element or layer is "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers in between. or layers. Throughout, the same reference numerals denote the same components. The word "and / or" used here includes any or all combinations of one or more related items listed.

[0042]It will also be understood that although terms such as first and second may be used to describe various components, components, regions, layers and / or sections, such terms are not used to limit them. Such terms are only used to distinguish one element, compo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In a substrate processing apparatus for forming thin layers on a substrate used for an organic light emitting diode, the apparatus includes a mask attaching chamber, a deposition chamber and a mask detaching chamber. The mask attaching chamber, the deposition chamber and the mask detaching chamber are provided with a transferring guide installed thereinside, and a substrate supporter for supporting the substrate moves along the transferring guide in or between the chambers. Thus, a time for processing the substrate and an area for the apparatus may be reduced. Also, the chambers are grouped in one or more, and a gate valve is installed between the grouped chambers for opening and closing a path between the grouped chambers. Accordingly, the chambers may be continuously maintained in a vacuum state when any one of the chambers is repaired.

Description

[0001] related application [0002] This application claims the benefit of Korean Patent Applications No. 2005-11334, No. 2005-18240 and No. 2005-27022 filed on February 7, 2005, March 4, 2005 and March 31, 2005, which The entire contents of are incorporated into this application by reference. technical field [0003] The present invention relates to substrate processing apparatus. In particular, the present invention relates to an apparatus for performing a process for forming a thin film on a substrate applied to an organic light emitting diode. Background technique [0004] Recently, information processing devices are rapidly developing, and they have various shapes and functions for rapidly processing data. This type of information processing apparatus has display means for displaying processed information. Such a display device mainly adopts a cathode ray tube type display device, however, compared with a cathode ray tube type display device, a flat panel display dev...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/20H01L21/31H01L21/3205H01L21/00C23C14/00C23C16/00
CPCY02E10/549H01L21/67011H01L2924/12044H10K71/10H10K77/10H10K71/00
Inventor 安基喆郑领哲河泰荣张祯元卢一镐李承培
Owner SEMES CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products