Heat pipe

Abstract

Present invention relates to computer fittings technology field, in particular referring to inner thermal pipe of computer radiator. Said thermal pipe has a hollow copper tube with sintered copper ball powder layer, which contains different kinds of easy hydroscopic inorganic salt ball and has different adding proportion in different section of copper tube. Said copper tube has obstruct layer in inner wall without generating sintering reaction with copper at lower 800 degree centigrade, which makes copper ball powder layer not sintering with copper tube. Due to copper tube inner wall having obstruct layer, copper ball powder layer can form a thin layer gap which forms the water duct to increase water storage, to make water flow unhindered, and reducing knee bend or stress for avoiding fracture.

Description

Technical field: [0001] The invention relates to the technical field of computer accessories, in particular to a heat pipe inside a computer radiator. Background technique: [0002] The calculation speed of the current electronic product chips is getting faster and faster, so the radiators used are gradually unable to meet the demand. In order to improve the heat dissipation rate of the metal sheet of the radiator, many radiators are currently equipped with heat pipes to improve heat conduction rate. [0003] See attached figure 1 As shown, the principle of the heat pipe is: a copper tube 01 sealed at both ends, and its inner edge has a layer of medium (wick) that enables the liquid to transport the liquid by capillary action. When the liquid at the heating end is vaporized, it travels along the central space to the The cooling end is cooled to liquid again, and then returns to the heating end along the conveying medium on the inner edge, so that the purpose of rapid heat ...

AI Technical Summary

Problems solved by technology

Because the copper ball will be fused due to cohesion after melting, if the control is not good, it will easily cause the pores in some places to be larger, while the pores in some places will be narrower, thereby hindering the capillary action of water backflow or appearing due to insufficient sintering. lead to structural fragility of the heat pipe

In addition, after the heat pipe is bent or flattened, the welding interface will be cracked, which will also hinder the return of water

[0007] It is difficult to fully inspect the thermal resistance performance of heat pipe products, because the measurement time of a product is too long, so it can only be carried out by random inspection

However, the random inspection can only represent the overall level, and there are still a small number of products that are over-sintered and the pores are too small, which makes the capillary phenomenon not good and the performance declines; or the fusion is insufficient and the structure of the catheter is fragile.

[0008] On the other hand, many heat pipes must be bent or flattened. This process will generate stress on the sintered copper ball powder, and some will break immediately, resulting in poor water flow; and some will break after being delivered to the user for a period of time. Phenomenon, causing overheating of the server products where the heat pipe is located or the multimedia computer with a huge workload

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