Semiconductor chip mounting body and manufacturing method thereof

Abstract

A semiconductor chip (20) having protruding electrodes (bumps) (23) on external lead-out electrodes is mounted on a wiring board (10), and a semiconductor chip (30) is mounted on the semiconductor chip (20). Between the wiring layer (12) of the wiring substrate (10) and the protruding electrodes (23) of the semiconductor chip (20), and between the protruding electrodes of the semiconductor chips (20), (30) are electrically connected by electrolytic plating. Between the wiring layer (12) and the protruding electrodes (23) and between the protruding electrodes of the semiconductor chip (20) (30) are stably connected through the plating films (24), (33).

Description

technical field [0001] The present invention relates to a semiconductor chip package in which a plurality of semiconductor chips are flip-chip connected and a method for manufacturing the same. Background technique [0002] In response to social demands for miniaturization and weight reduction of electronic equipment, semiconductor devices such as LSI (Large Scale Integrated circuit) are being further miniaturized and densified. As one of the methods for such miniaturization and high density, stacking of semiconductor chips is being promoted. [0003] Before, such as figure 2 As shown, a small-sized semiconductor chip 102 is mounted on a large-sized semiconductor chip 101 mounted on a wiring substrate 100 through an adhesive or the like. Resin sealing performs lamination of such semiconductor chips. In order to achieve further miniaturization and higher density, it is necessary to make each chip thinner while reducing the size of the semiconductor chip. [0004] However,...

AI Technical Summary

Problems solved by technology

However, conductive adhesives are poor in conductivity, and because of low adhesive strength, there is a disadvantage in that the electrical characteristics of semiconductors that change frequently are degraded with the increase in the age of use.

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