Heat radiation cooling device for CPU chip

A CPU chip, heat dissipation and cooling technology, applied in the field of computer components, can solve the problems of fan noise, heat dissipation device can not achieve the ideal heat dissipation effect, affect the use environment, etc., to achieve the effect of avoiding noise

Inactive Publication Date: 2006-04-12
陈欢
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The CPU chip of the computer generates heat when it is working. When the temperature rises, it needs a radiator to dissipate heat. At present, the heat dissipation device of aluminum heat sink and fan is used. With the continuous improvement of CPU computing speed, the heat generation increases. Existing The cooling device can not achieve the ideal cooling effect
In addition, the fan will produce noise, affecting the use environment

Method used

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  • Heat radiation cooling device for CPU chip

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Embodiment Construction

[0009] As shown in the figure, the present invention is provided with a hollow inner radiator 1 at a position close to the chip 5, and its inner cavity is filled with a liquid 2 with a low boiling point, and the volume of the liquid is smaller than that of the inner cavity. The cold surface of the sheet 4 is connected, and the hot surface of the semiconductor refrigeration sheet 4 is connected with the outer heat sink 3 .

[0010] Described low boiling point liquid, what the embodiment adopts is methanol, pours into the inner cavity of inner radiator 1 in an appropriate amount, is about half, and vacuumizes the air therein, to further reduce its boiling point.

[0011] When working, the chip 5 generates heat, and the liquid 2 in the inner radiator 1 absorbs heat. When the temperature is higher than its boiling point, the liquid vaporizes and condenses in a cooler place, that is, close to the semiconductor cooling chip 4, and becomes a liquid again, forming a cycle. Let the hea...

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Abstract

This invention relates to a radiation device for computer CPU chips, which sets a hollow internal radiator at the place closing to the chip filled with a liquid of low boiling point in its inner cavity, in which, the volume of the liquid is smaller than the inner cavity, the internal radiator is connected with the cooling face of the semiconductor cooling plate, the hot face of which is connected with an external radiation plate. When working, the liquid is vaporized from absorbing heat and cooling the chip and the steam is cooled near the semiconductor cooling plate and liquidized again to form circulation to keep the chip at the state of low temperature. Noise is avoided since there is no fan.

Description

technical field [0001] The invention relates to computer components, in particular to a heat dissipation and cooling device for a CPU chip in a computer. Background technique [0002] The CPU chip of the computer generates heat when it is working. When the temperature rises, it needs a radiator to dissipate heat. At present, the heat dissipation device of aluminum heat sink and fan is used. With the continuous improvement of CPU computing speed, the heat generation increases. Existing The heat dissipation device can't achieve the ideal heat dissipation effect. In addition, the fan will generate noise, affecting the use environment. Contents of the invention [0003] The object of the present invention is to provide a CPU chip heat dissipation cooling device with good heat dissipation effect and no noise. [0004] The solution of the present invention is: a hollow inner radiator is provided at the position close to the chip, and a low boiling point liquid is filled in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/34
Inventor 陈欢
Owner 陈欢
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