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Electroplating additive and its preparation method

An electroplating additive and total weight technology, which is applied in the direction of metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of easy turbidity, poor dispersion, and coarse crystallization of the plating solution, and achieve good weldability, eliminate compressive stress, and crystallization detailed effect

Active Publication Date: 2006-02-15
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, through the design of the formula composition of the additive, the problems including poor dispersion, coarse crystals, easy burning, and easy turbidity of the plating solution have been basically solved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0015] Example 1 (suitable for rack plating)

[0016] (1) formula (weight %):

[0017] Dodecylphenol ethoxylate 5

[0018] Polyoxyethylene aniline ether 1

[0019] N,N-diethyl-m-toluidine 1.2

[0020] Hydroxylactide 2.5

[0021] Acetylglycine 1.5

[0022] Naphthalenesulfonic acid 1

[0023] Propylene Glycol Polyoxyethylene Polyoxypropylene Ether 3

[0024] Hydroquinone 1

[0025] water 83.8

[0026] (2) Preparation method:

[0027] Weigh the required amount of deionized water into the reaction kettle, and heat to 45-55°C. In another reactor, mix N,N-diethyl-m-toluidine and hydroxypropionic acid, raise the temperature to 50° C., and stir for 10 minutes. The mixture of N,N-diethyl-m-toluidine and hydroxypropionic acid was added to deionized water with stirring. Then, add dodecylphenol polyoxyethylene ether, polyoxyethylene aniline ether, acetylglycine, naphthalenesulfonic acid, propylene glycol polyoxyethylene polyoxypropylene ether and hydroquinone in sequence. Cont...

example 2

[0028] Example 2 (suitable for high-speed plating)

[0029] (1) formula (weight %):

[0030] Dodecylphenol ethoxylate 3

[0031] Polyoxyethylene aniline ether 1

[0032] Dimethylaminopropylmethacrylamide 2

[0033] Acetylglycine 1.5

[0034] Naphthalenesulfonic acid 1

[0035] Internal glycol polyoxyethylene polyoxypropylene ether 3

[0036] Polyoxyethylene polyoxypropylene monobutyl ether 1

[0037] Hydroquinone 1

[0038] water 86.5

[0039] (2) Preparation method:

[0040] Weigh the required amount of deionized water into the reaction kettle, and heat to 45-55°C. Under stirring, add dodecylphenol polyoxyethylene ether, polyoxyethylene aniline ether, dimethylaminopropyl methacrylamide, acetylglycine, naphthalenesulfonic acid, propylene glycol polyoxyethylene polyoxypropylene ether, polyoxyethylene Ethylene polyoxypropylene monobutyl ether and hydroquinone. Continue to stir for 1 hour, filter, measure and pack into barrels.

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PUM

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Abstract

The invention relates to synthesis method for leadless pure tin electroplating additive. Wherein, mixing lauryl phenol polyoxydivinyl ether, polyoxyethylene aniline ether, N, N-diethylm toluidine, hydracrylic acid, acetylglycine acid, naphthalene sulfonic acids, polyoxyethylene polyoxyprophylene propylene, and hydroquinone, and deionized water evenly by turns on given physical conditions; adjusting the constituents to eliminate compressive stress, control crystal process, and form perfect, normal crystallization structure; controlling particle size, thickness of plating layer and tin expansibility to solve generation problem of tin whisker. This invention is also easy to maintenance and needs low consumption.

Description

Technical field: [0001] The invention relates to an electroplating additive, in particular to a lead-free pure tin electroplating additive capable of suppressing the formation of tin whiskers and a preparation method thereof. Background technique: [0002] At present, tin-lead alloy plating is widely used in electronic packaging industry for solderability plating. However, since lead and its compounds are toxic substances, long-term use will harm the human body and the environment. Therefore, in recent years, people have proposed Sn-Bi, Sn-Cu, Sn-Ag, Sn-Zn, etc. or ternary alloys as solderable coatings instead of Sn-pb, but due to material compatibility, toxicity, cost, Various reasons such as mechanical properties, wettability, and aging make it impossible to replace Sn-pb solderable coatings. Another generally accepted by the electronic packaging industry is to use pure tin as the lead-free solderability plating. [0003] However, there are also many problems in pure tin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32B23K1/20
Inventor 王福祥贺岩峰
Owner SHANGHAI SINYANG SEMICON MATERIALS
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