Substrate inspection apparatus

Abstract

The objective of the invention is to provide a substrate inspection device capable of clearly imaging the pattern on a substrate. An imaging head 10 is equipped with a CCD line sensor 20, six first illumination means 30 and a pair of second illumination means 40. The second illumination means 40 are arranged on both sides of the LED arranging direction in the first illumination means 30 so that the irradiation angle of the lights emitted from the second illumination means 40 to the surface of the substrate when the lights emitted from the second illumination means 40 are projected on a reference plane abcd is different from the irradiation angle to the surface of the substrate of the lights emitted from the first illumination means 30 when the lights emitted from the first illumination means are projected on the reference plane abcd.

Description

technical field [0001] The present invention relates to a substrate inspection device for judging whether a pattern printed on a substrate is good or not by analyzing an image obtained by imaging the surface of the substrate. Background technique [0002] In the past, as such a substrate inspection apparatus, a substrate inspection apparatus having a structure including a CCD (Charge Coupled Device) line sensor and a CCD arranged in the arrangement direction of the CCD in the CCD line sensor has been known. The linear light source reads the image of the substrate in a rectangular shape by moving these CCD line sensors and the linear light source in the scanning direction relative to the surface of the substrate. Such a conventional substrate inspection apparatus has a problem that accurate density information of an image cannot be obtained when the illuminance distribution of the area illuminated by the CCD line sensor on the substrate is not uniform. [0003] Therefore, as...

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Problems solved by technology

[0004] In recent years substrates in which printed patterns have been miniaturized and the surface of the substrate has been treated to make it a smoother plane than in the past due to this miniaturization, it is difficult to cause scattering on the surface of the substrate. In the substrate inspection device described in the New Registration No. 2562299, it is sometimes difficult to obtain clear density information due to the unevenness of the pattern in the CCD line sensor CCD arrangement direction.

As a result, there is a problem that the pattern printed on the substrate cannot be photographed clearly

[0005] For example, in the direction of the scanning movement of the CCD line sensor relative to the substrate (the direction perpendicular to the arrangement direction of the CCD line sensor), there is an unclear The problem of different shades of thin line patterns and grooves (recesses corresponding to gaps between thin lines) between thin line patterns

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