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Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver

An integrated circuit and microwave single-chip technology, which is applied in the direction of assembling printed circuits, circuits, and printed circuits with electrical components, can solve problems such as reliability degradation and achieve effective heat dissipation

Inactive Publication Date: 2005-06-08
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This means that the flanged MMIC 7 is first fixed to the metal chassis 3 with screws 4, and thereafter by hand soldering the terminals 7c, which is likely to cause a deterioration in reliability due to manual work.

Method used

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  • Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver
  • Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver
  • Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver

Examples

Experimental program
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Effect test

no. 1 example

[0040] refer to Figures 1 to 6 , describes an MMIC-mounted substrate according to a first embodiment of the present invention. Such as figure 1 As shown, the substrate on which the MMIC is installed includes a double metal foil dielectric substrate 2 , an MMIC 1 and a metal chassis 3 . exist figure 1 In , for the convenience of description, the MMIC1 is shown as being separated from the double metal foil dielectric substrate 2 . MMIC1 is a surface mount high power amplifier and is disposed on one side of a double metal foil dielectric substrate 2 . A metal chassis 3 is attached to the other side of the dual metal foil dielectric substrate 2 . figure 2 yes figure 1 An enlarged partial cross-sectional view of the substrate on which the MMIC is mounted is shown. Such as figure 2 As shown, a double metal foil dielectric substrate 2 has copper foil patterns 2c formed as metal foil patterns on both sides of a dielectric substrate 2e. The double metal foil dielectric su...

no. 2 example

[0054] refer to Figures 7 to 9 , describes an MMIC-mounted substrate according to a second embodiment of the present invention. Such as Figure 7 As shown, the substrate on which the MMIC is mounted includes a double metal foil dielectric substrate 2 , an MMIC 1 , a metal chassis 3 and screws 4 . exist Figure 7 In , for the convenience of description, the MMIC1 is shown as being separated from the double metal foil dielectric substrate 2 . Screws 4 pass through the dual metal foil dielectric substrate 2 to connect to the metal chassis 3 . Figure 8 is the plan view before screw 4 connection. Such as Figure 8 As shown, the screw holes 2d are provided outside the area of ​​the double metal foil dielectric substrate 2 occupied by the MMIC body 1a, and relatively close to the MMIC body 1a. Screw holes 2d are provided in the ground pattern 2c1.

[0055] Such as Figure 9 As shown, the screw 4 is screwed in the screw hole 2d. Screw 4 separates from MMIC1.

[0056] When ...

no. 3 example

[0063] refer to Figure 10 and 11 , describes an MMIC-mounted substrate according to a third embodiment of the present invention. Such as Figure 10 As shown, the substrate on which the MMIC is installed includes a double metal foil dielectric substrate 2 , an MMIC 1 , a metal chassis 3 , a cooling plate 5 and screws 4 . exist Figure 10 In , for the convenience of description, the MMIC1 is shown as being separated from the double metal foil dielectric substrate 2 . The heat dissipation plate 5 is in contact with the top surface of the MMIC 1 and has through holes for passing the screws 4 therethrough. The cooling plate 5 is preferably made of metal. The screw 4 passes through the cooling plate 5 and is fastened to press the cooling plate 5 onto the MMIC1 at the same time, as Figure 11 shown in the sectional view.

[0064] Other components and structures other than those discussed above are similar to those described with reference to the first and second embodiments, ...

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Abstract

A substrate for mounting MMIC (Microwave Monolithic Integrated Circuit) is provided, comprising: a double metal foil dielectric substrate (2) having a dielectric substrate and metal foil patterns formed on both sides of the substrate; an MMIC as a high power amplifier on one side of said dual metal foil dielectric substrate (2); and a metal chassis (3) attached to the other side of said dual metal foil dielectric substrate (2). The double metal foil dielectric substrate (2) has a plurality of through holes (2a), and the copper foil pattern as a metal foil pattern extends continuously to cover each inner surface of the through holes (2a) and both sides of the dielectric substrate , and fill the solder in the through hole (2a).

Description

[0001] This application claims the benefit of Japanese Patent Application No. 2003-405961 and No. 2004-292417 filed with the Japan Patent Office on December 4, 2003 and October 5, 2004, respectively, the entire contents of which are hereby incorporated by reference . technical field [0002] The present invention relates to a substrate having a microwave monolithic integrated circuit (hereinafter "MMIC") mounted thereon. The substrate on which the MMIC is mounted is mainly used in satellite communication transmitters, especially in Ku-band transceivers and Ku-band transmitters. Background technique [0003] Japanese Utility Model Publication No. 5-31307 discloses a conventional technique for promoting heat dissipation of high output transistors of high power amplifiers. Furthermore, Japanese Patent Laid-Open No. 2003-06053 discloses a conventional technique of mounting a semiconductor device of a radio communication module that generates a large amount of heat on a multilay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L21/60H01L23/367H01L23/40H05K1/02H05K1/11H05K1/16H05K1/18H05K3/32H05K3/34
CPCH01L23/3677H01L23/4006H01L24/81H01L2224/81801H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/01033H01L2924/01079H01L2924/01082H01L2924/014H01L2924/14H01L2924/1423H01L2924/19043H05K1/0206H05K1/0243H05K3/0061H05K3/325H05K3/3421H05K2201/0715H05K2201/09572H05K2201/10409H05K2201/10689
Inventor 中村真喜男荏隈俊二
Owner SHARP KK
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