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Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature

A cooling device and computer technology, applied in computing, instrumentation, electrical digital data processing, etc., can solve the problems of difficult manufacture of heat pipes, limitations in wide application, preparation of core materials, packaging of working fluid, complex maintenance, etc., and achieve simple structure, The effect of wide range of working medium and low cost

Inactive Publication Date: 2005-05-04
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat pipe is not easy to manufacture, such as the preparation of the core material, the packaging of the working fluid, and the maintenance are quite complicated, which greatly limits its wide application

Method used

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  • Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature
  • Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature
  • Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature

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Embodiment 2

[0034] attached image 3 It is a structural schematic diagram of the present invention, which is also another embodiment of the present invention; by image 3 It can be seen that the solute dissolution cooling device for computer chip cooling of the present invention further includes: a condenser installed between the heat dissipation surface of the liquid storage tank 1 and the heat dissipation fan, and the condenser housing 8 of the condenser draws Vacuum and filled with solute solution, heat dissipation fins 51 are installed on the outer surface of the condenser shell; the lower end of the condenser shell is connected to the inlet of the micropump 12 through the liquid return pipeline 11, and the outlet of the micropump 12 is connected to the liquid storage tank through the return pipeline 13 1 is connected, and the steam pipe 10 of the condensing casing 8 is connected with the upper end of the liquid storage tank 1. The solute contained in the liquid storage tank 1 of this...

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Abstract

The invention is a computer chip cooling device that reduces the temperature by solute dissolution, which comprises: a liquid storage tank holding the solute solution, many radiating ribs installed on the radiating surface of the liquid storage tank and a cooling fan installed above the radiating surface; a condenser can also be installed between the radiating surface and the radiating fan, and radiating ribs are installed on the external surface of a condenser casing; a cold end of the condenser casing is connected with the inlet of a micro pump, and the outlet of the micro pump is connected with the liquid storage tank; a hot end of the condenser casing is connected with the liquid storage tank; an elastic valve is hung on the top in the liquid storage tank; its manufacture technique is simple and it has the advantages of wide controllable temperature range, high radiating speed, operating simplicity, structure simplicity, low cost, etc; and it can meet the requirement of computer application with the daily increase of heating density.

Description

technical field [0001] The invention relates to a cooling device for cooling computer chips, in particular to a solute-dissolving cooling device for cooling computer chips. Background technique [0002] An important problem in high-power electronic equipment such as personal computers, workstations, and notebook computers is how to stabilize the chip at a reasonable operating temperature, even if the high-density heat generated by the chip can be dissipated quickly and effectively. The difficulty of cooling a tiny system such as a computer chip is that: for the existing cooling methods and architectures, firstly, excessively high cooling air velocity will cause large acoustic noise; secondly, the compactness of the electronic equipment architecture requires only It is allowed to reserve a limited cooling space; third, the installation of large-size heat sinks on the module should be avoided as much as possible. The above problems all illustrate the importance of developing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/473
Inventor 刘静李腾周一欣
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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