Method for testing flexible circuit board connection qualification and flexible circuit board with testing pad
A flexible circuit board and test pad technology, applied in the direction of measuring electricity, measuring electrical variables, electronic circuit testing, etc., can solve the problems of inability to measure flat-panel displays, unable to confirm the connection of flexible circuit boards, etc., to reduce the time for abnormal causes , the effect of improving productivity
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[0015] figure 1 As shown, it shows a schematic top view of a flexible circuit board according to a preferred embodiment of the present invention; figure 2 As shown in FIG. 2 , it shows a schematic diagram of testing the joint pass rate of the flexible printed circuit board according to a preferred embodiment of the present invention.
[0016] Please refer to figure 1 and figure 2 According to the method for testing the bonding yield of a flexible circuit board of the present invention, a flexible circuit board 100 is firstly provided, wherein the flexible circuit board 100 has several contacts 102 . Next, several test pads 104 are provided on the flexible circuit board 100 , wherein each test pad 104 is configured corresponding to each contact 102 , and the test pads 104 and the contacts 102 are electrically isolated from each other.
[0017] In a preferred embodiment, the method of disposing the test pad 104 on the flexible circuit board 100 is, for example, forming seve...
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