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Film tearing method

A technology of protective film and printed circuit board, applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve problems such as poor processing quality and accumulation

Inactive Publication Date: 2004-11-03
COMPEQ MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, since the known method is carried out when the printed circuit board 100 is placed in a horizontal state, it is easy for the dust 130 to accumulate on the surface of the printed circuit board 100 due to the effect of gravity, resulting in the disadvantage of poor subsequent processing quality.

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0032] figure 2 Shown is a schematic diagram of the film tearing method using ion wind according to the first preferred embodiment of the present invention. Please refer to figure 2 As shown, according to the film tearing method of the first preferred embodiment proposed by the present invention, a first protective film 210 is torn off from the surface layer of the printed circuit board 200 through two suction cup units (not shown). Wherein, the printed circuit board 200 is placed in a substantially vertical state relative to a horizontal plane, and a first protective film 210 and a second protective film 220 are pasted on the surface layer of the printed circuit board 200 and the opposite surface layer respectively. The film tearing method according to the first preferred embodiment of the present invention includes at least the following steps: Step 1, providing a printed circuit board 200, which has a first protective film 210 and a second protective film 220 , respecti...

no. 2 example

[0040] FIG. 6 is a schematic diagram of the relationship between the printed circuit board and the horizontal plane in the film tearing method according to the second preferred embodiment of the present invention. Please refer to FIG. 6 , the steps of the film tearing method are roughly the same as the film tearing method of the first preferred embodiment, and the similarities will not be repeated here. The difference is that in step 2, an angle 290 can also be formed between the printed circuit board 200 and the horizontal plane 280, and the angle 290 is not limited to 90 degrees as in the first embodiment, and can also be between 30 degrees and 90 degrees any angle in between.

[0041]It should be noted that, according to the preferred embodiment of the present invention, the shape of the printed circuit board is not limited to a quadrangle, and other possible shapes are also possible. In addition, when tearing off the protective film, the protective film attached to one su...

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Abstract

A stripping method is suitable for stripping the protection layer on a PCB utilizing a chuck unit to tear out a protection film adhered on the surface of the PCB which is put vertical to water level. Beside, in the process of tearing out the film, a cleaner collects the generated powders, an ionic fan blowing out ionic wind and a static control rod eliminate the generated static electricity. Since the PCB is laid vertical to water level, the stripping method can improve the shortcoming of stacking powders on the surface of the PCB to increase the successive processing quality.

Description

technical field [0001] The present invention relates to a film tearing method, and in particular to a film tearing method that can improve the defect that powder dust accumulates on the surface of a printed circuit board during the film tearing step and affects subsequent processing quality. Background technique [0002] In this era of ubiquitous high-tech applications, people's lives are full of various technological products, such as notebook computers (Note Book), mobile phones (Cell Phone), liquid crystal displays (Liquid crystal display, LCD) and tablet computers ( Tablet PC), etc. Among them, the vast majority of high-tech products include precision flat components, such as printed circuit boards and light guide plates. Since the concept of reducing costs through mass production is widely followed, many precision flat-shaped components must be completed through multiple processes, and then transported to the next process for subsequent processing. Such precision flat...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 许博胜王文瑞
Owner COMPEQ MFG
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