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Heat-resistant synthetic fiber sheet

A synthetic fiber, heat-resistant technology, applied in the directions of synthetic cellulose/non-cellulose material pulp/paper, fiber raw material processing, thin material processing, etc., can solve the problems of insufficient electrical insulation, twisting, deformation, etc.

Inactive Publication Date: 2004-08-18
TEIJIN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide excellent heat resistance, thermal dimensional stability, electrical insulation under high humidity, etc., especially suitable as a base material for circuit laminates, and to solve or reduce the conventional heat-resistant synthetic fiber sheet The above-mentioned problems, especially the deformation (distortion, bending, undulation, etc.) Heat-resistant synthetic fiber sheet that can be produced without compromising productivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] By using heat-resistant organic synthetic polymer short fibers composed of copolyparaphenylene 3,4'-oxydiphenylene terephthalamide, the single fiber fineness is 1.67 decitex (1.5de) , 95% by weight of short fibers (manufactured by Teijin Co., Ltd., trademark: TECHNORA) with a fiber length of 3 mm and an equilibrium moisture content of 1.8%, and poly-m-phenylene-m-benzene, which is a heat-resistant organic synthetic polymer fibrid 5% by weight of fibrids composed of diformamide (manufactured by Dupon Co., Ltd., trademark: NOMEX) was immersed and dispersed in water using a pulper, and a dispersant (manufactured by Matsumoto Yushi Co., Ltd., trademark : YM-80), made into short fiber / fibrid pulp for papermaking with a fiber concentration of 0.20% by weight.

[0120] Short fibers composed of copolymerized p-phenylene·3,4'-oxydiphenylene·terephthalamide are cut into the cut plane and perpendicular to The angle formed by the plane of the fiber axis is 32 degrees, and the maxi...

Embodiment 2～4 and comparative example 1～2

[0125] In each of Examples 2 to 4 and Comparative Examples 1 to 2, a heat-resistant synthetic fiber sheet was produced in the same manner as in Example 1, a prepreg sheet was produced, and a laminate for a circuit board was produced, and various characteristics were measured. However, the mixing ratio of the copolymerized p-phenylene·3,4'-oxydiphenylene·terephthalamide short fibers and the polym-phenylene isophthalamide fibrids used in Example 1 Changes as shown in Table 1. The composition of the obtained aramid fiber sheet is shown in Tables 1, 2 and 3, d 1 / d 2 Ratio, properties of the laminate.

Embodiment 5

[0127] The same experiment as in Example 2 was carried out. However, instead of the staple fibers (trademark: TECHNORA) used in Example 2, 90% by weight of polyparaphenylene terephthalamide staple fibers (single fiber fineness: 1.58 decitex (1.42de), fiber length : 3 mm, manufactured by Dupon Co., Ltd., trademark: KEVLAR). The inclination angle of the end surface of the short fiber is 35 degrees, and the maximum diameter d of the annular protrusion formed at both ends is 1 and the average diameter d of its middle part 2 than d 1 / d 2 It is 1.17. The composition of the obtained aramid fiber sheet is shown in Tables 1, 2 and 3, d 1 / d 2 Ratio, properties of the laminate.

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Abstract

A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.

Description

technical field [0001] The present invention relates to a heat-resistant synthetic fiber sheet (heat-resistant synthetic fibrous sheet). More specifically, it relates to a heat-resistant synthetic fiber sheet that is excellent in heat resistance and electrical insulation and can be applied to laminates for circuits. Background technique [0002] For base materials used in laminates for circuit boards, heat resistance or heat-resistant dimensional stability, moisture-resistant dimensional stability, electrical insulation, and deformation resistance (hard to twist, bend, and undulate, etc.) are required. Excellent properties. In addition, in circuit boards for small electronic devices such as mobile phones and notebook computers, higher wiring density is required, and therefore various properties such as lighter weight are required for the substrate material in combination with the above-mentioned properties. Compared with sheet-shaped base materials composed of other raw ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/10B29C70/12B29C70/20B32B15/14D21H13/24D21H13/26D21H21/18H05K1/03
CPCY10T428/24116Y10T428/24124B32B15/14D21H21/18Y10T428/254D21H13/26Y10T428/2419H05K2201/0278H05K2203/0594Y10T442/2008B29C70/10Y10T442/696B29C70/12H05K2201/0293H05K2201/0251Y10T428/24264Y10T428/25B29C70/202D21H13/24Y10T428/26H05K1/0366Y10T428/24994B32B2260/021B32B2305/076B32B2260/046B32B2307/306B32B15/20B32B2457/08
Inventor 藤森龙士村山定光
Owner TEIJIN LTD
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