Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

IC card

A support and chip technology, applied in the field of personal authentication cards, can solve problems such as IC chip cracking, card damage, and inability to work normally, and achieve the effect of improving bending strength and protecting IC chips

Inactive Publication Date: 2004-04-21
KONICA CORP
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, although the durability has been improved to a certain extent, sufficient durability cannot be obtained for various conditions, such as durability against shocks subjected to sudden stress, repeated bending durability under repeated stress, and repeated local loads. These situations will cause the IC chip to break or the card to be damaged, and then it will not work normally.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IC card
  • IC card
  • IC card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] (production of IC card)

[0122] Figure 10 It is an example of the lamination structure of the IC card and personal authentication card of this invention.

[0123] Support body 1:

[0124] A white polyester sheet with a thickness of 125 μm was used for the first support on the surface side and the second support on the back side.

[0125] Support body 2:

[0126] A white polyester sheet with a thickness of 188 m was used for the first support on the surface side and the second support on the back side.

[0127] (Fabrication of surface-side support)

[0128]

[0129] On the corona discharge treated surface of 125 μm, the first coating solution for forming the imaging layer, the coating solution for forming the second imaging layer, and the coating solution for forming the third imaging layer of the following composition are sequentially coated The coating solution was applied, dried, and stacked to form image-forming layers with respective thicknesses of 0.2 μm, ...

Embodiment 2

[0264] It produced similarly to Example 1 except having used the support body 2 as a front and back support body, and having produced the sheet|seat 2 for IC cards as follows.

[0265] (Production of IC card sheet 2)

[0266] use Figure 11 The above-described card manufacturing apparatus used the aforementioned back support and the surface support having the image-developing layer, which were produced using the support 2 as the first support and the second support.

[0267] Adhesive 1 was applied to a thickness of 34 μm on the first support on the surface side with the imaging layer using a T die, and was applied to a thickness of 34 μm on the second support on the back side using a T die. 300 μm thickness, on the first support on the surface side with the adhesive, place such as Figure 8 IC modules constituted as shown, as Figure 12 It was placed on the second support side with the circuit side on the back side, sandwiched between upper and lower sheets, and laminated a...

Embodiment 3

[0272] Except that the IC module was the IC module 2, it produced similarly to Example 2. The thickness D1 of the adhesive between the reinforcing plate and the support was 30 μm, and the ratio of the maximum length T1 of the reinforcing plate as a reinforcing structure was D1 / T1=0.004. The thickness D2 of the adhesive between the IC chip and the support was 149 μm, and the ratio to the maximum length T1 of the reinforcing plate as the reinforcing structure was D2 / T1=0.021.

[0273] After the produced IC card was strongly rolled into a cylinder with R = 25mm in the long side direction, the front side and the back side were each strongly rolled and fixed for 24 hours, the IC worked normally. After 100 repeated bending tests, there is no deformation and the IC works normally. A load of 1 kg was applied 10 times to a rubber sheet with a hardness of 50 on each of the circuit surface and the non-circuit surface of the IC chip with a steel ball with a tip diameter R=1mm, and no dam...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

An IC card, comprising: a first support; a second support; an IC module including an IC chip, a reinforcing structural member neighboring to the IC chip and an antenna; the IC module provided between the first and second supports; a first adhesive layer provided between the first support and the reinforcing structural member; and a second adhesive layer provided between the second support and the IC chip. When the IC card is curved with a radius R1 of curvature, the following formula is satisfied: R1 B42D 15 / 10 G06K 19 / 07 G06K 19 / 077 12 26 2 2003 / 6 / 27 1490762 2004 / 4 / 21 000000000 Konica Corp. Japan Takahashi Hideki wang jian 11038 The Patent Agency of the Chinese Council for the Promotion of International Trade (CCPIT) No.1 Waidajie, Fuxingmen, Beijing 100086 Japan 2002 / 7 / 2 193257 / 2002

Description

technical field [0001] The present invention relates to a non-contact electronic card for storing personal information requiring security against forgery, alteration, etc., or a personal authentication card suitable for a sheet. Background technique [0002] Magnetic cards in which data is recorded by a conventional magnetic recording method are widely used in identification cards (ID cards) and credit cards. However, magnetic cards are relatively easy to rewrite data, so there are disadvantages such as insufficient protection against data changes, easy to be affected by the outside world, insufficient data protection, and small further recordable capacity. [0003] Therefore, in recent years, IC cards with built-in IC chips have been popularized. The IC card reads and writes data with the external machine through the electrical contacts on the surface or the loop antenna inside the card. Compared with magnetic cards, IC cards have larger storage capacity and greatly impro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B42D15/10B32B33/00B32B37/12G06K19/07G06K19/077G06K19/10
CPCB32B37/12G06K19/07728B32B2307/546B32B2519/02B32B2425/00B32B33/00B32B2305/342G06K19/07
Inventor 高桥秀树
Owner KONICA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com