Chemical machinery grinding equipment

Abstract

The invented chemical mechanical polishing (CMP) device is suitable to present manufacturing technique. Slim grinding pressboard with size less than the size of wafer is utilized in the invented CMP device. Thus, the layout can be pressed and space can be used effectively so as to reach high yield and effective production management. The CMP device can select diversified grinding pad and / or grinding pulp, thus, flexible manufacturing procedure can be arranged by the CMP device.

Description

technical field [0001] The present invention relates to a chemical mechanical polishing apparatus, and more particularly to a chemical mechanical polishing apparatus having at least one elongated platen. Background technique [0002] As semiconductor components continue to shrink, the demand for multilayer interconnection increases relatively. The multilayer metal structure can provide greater flexibility in circuit design and actual reduction of chip size and chip cost. In integrated circuits, at least two to five metal layers are generally used, so it is important to perform a planarization step on the rough surface of the wafer, so that the fabrication process of multilayer interconnects can be carried out smoothly, and The wire pattern can be transferred more accurately. In addition, in the alignment system, the flattening of the wafer is the most important factor affecting the accuracy of the alignment. If the flattening step of the wafer is not done well, not only the...

AI Technical Summary

Problems solved by technology

[0005] by the above figure 1 In the setup, it can be clearly seen that the size of the circular lapping platen must be larger than the wafer because other units, such as regulators and / or slurry supply lines are mounted on or above the platen; In other words, the size of CMP equipment is limited by the size of the platen, which must be larger than the size of the wafer. When the size of the wafer continues to increase, the design of traditional CMP equipment cannot further reduce the size

[0006] In addition, in the standard manufacturing process of forming the copper plug structure, at least two polishing pads with different selectivity ratios are required to polish the copper layer and the barrier layer respectively, so it is unavoidable to exchange the polishing pad during the CMP process or between Transfer of wafers between different grinding platens, which is the bottleneck encountered in increasing production capacity, and thus leads to ineffective line management

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