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Welding-resistant low-alkaline ink for developing and photosenstive imaging

A solder-resist ink and imaging technology, which is applied in ink, photosensitive materials for optomechanical equipment, household appliances, etc., can solve the problems of low heat resistance, high drying temperature, and poor gloss of printed circuit boards, and achieve improved Appearance level, good gloss, gloss improvement effect

Inactive Publication Date: 2003-01-15
广州市乃天精密电子器材有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this utility model is to overcome the shortcomings of the existing photosensitive imaging solder resist ink, such as long pre-baking time, high drying temperature, low production efficiency, low heat resistance and poor gloss of the printed circuit board, and provide a Short pre-baking time, low drying temperature, high production efficiency, high temperature resistance of printed circuit boards, good gloss, dilute alkali developing photosensitive imaging solder resist ink

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Embodiment 1 formula (weight %)

[0040] Host resin: modified acrylate photosensitive oligomer 57

[0041] Epoxy resin WSR6101, E-44 (produced by Wuxi Resin Factory) 13

[0042] Reactive diluent: Pentaerythritol triacrylate 8

[0043] Photoinitiator thioenone 5

[0044] Filler Quartz powder 16.5

[0045] Pigment Phthalocyanine Green 0.5

[0046] Mix the above formula raw materials together and press them into a green ink with a fineness of 10u and a viscosity of 300dps / 25°C with a three-roller machine. The obtained ink has good performance, and the printed circuit board made has high temperature resistance and good gloss. After being treated at a high temperature above 260°C, the ink coating will not change color, carbonize, burst, or fall off, and the gloss is better than that without high temperature treatment. There is a great improvement before the treatment, which improves the appearance level of the board.

Embodiment 2

[0047] Embodiment 2 formula (weight %)

[0048] Main resin: modified acrylate photosensitive oligomer 60

[0049] Epoxy resin WSR6101, E-44 (produced by Wuxi Resin Factory) 12

[0050] Reactive diluent: Trimethylolpropane triacrylate 9

[0051] Photoinitiator Thionenone 7

[0052] Filler Kaolin 11.5

[0053] Pigment iron red 0.5

[0054]Mix the above formula raw materials together and then use a three-roll machine to press into iron red ink with a fineness of 15u and a viscosity of 250dps / 25°C. The obtained ink has good performance, and the printed circuit board made has high temperature resistance and good gloss. After being treated at a high temperature above 260°C, the ink coating will not change color, carbonize, burst, or fall off, and the gloss is better than that without high temperature treatment. There is a great improvement before the treatment, which improves the appearance level of the board.

Embodiment 3

[0055] Embodiment 3 formula (weight %)

[0056] Main resin: modified acrylate photosensitive oligomer 63

[0057] Epoxy resin WSR6101, E-44 (produced by Wuxi Resin Factory) 10

[0058] Reactive diluent: Pentaerythritol triacrylate 5

[0059] and dipentaerythritol hexaacrylate 5

[0060] Photoinitiator Thionenone 9

[0061] Pigment Carbon black 0.5

[0062] Silicone oil trace

[0063] Mix the above-mentioned formula raw materials together and press them into a black ink with a fineness of 12u and a viscosity of 150dps / 25°C with a three-roller machine. The obtained ink has good performance, and the printed circuit board made has high temperature resistance and good gloss. After being treated at a high temperature above 260°C, the ink coating will not change color, carbonize, burst, or fall off, and the gloss is better than that without high temperature treatment. There is a great improvement before the treatment, which improves the appearance level of the boa...

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PUM

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Abstract

A weld-resistant ink for weakly alkaline developing and photosensitive imaging of PCB contains modified acrylate as photosensitive oligomer (50-70 wt.%), epoxy resin (10-20), multifunctional acrylate (5-20), optical trigger (5-15), filler (7.5-30), pigment (0.5-1) and silica oil. Its advantages are high resistance to high temp (260 deg.C or more) and lustre, and not discolouring and dropping off.

Description

technical field [0001] The invention relates to a dilute alkali developing photosensitive imaging solder resist ink. Background technique [0002] Computer products are changing with each passing day, and electrical products such as communication equipment are being updated and developed rapidly. The 21st century is the era of human beings entering the development and application of high technology. Social development requires electrical products. Electrical products are inseparable from circuit boards. Circuit boards range from single-sided to double-sided to multi-layered. Product precision requirements are getting higher and higher. Materials for manufacturing circuit boards, especially printed circuit board (PCB) inks , the requirements are very strict. At present, there are more PCB inks on the market, including Japan's Tamura, Taiwan's Sun, Britain's Gaoshi, and Singapore's Youlian; two of them in my country are patented technologies of Beijing University of Chemical ...

Claims

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Application Information

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IPC IPC(8): C09D11/101G03F7/004
Inventor 李学魁谷剧郑超英孙薇波郑学群朱梅生
Owner 广州市乃天精密电子器材有限公司
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