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Copper plated material, its manufacturing method and method for copper plating

A copper-plating material and a copper-plating technology are applied in the fields of copper-plating materials, their manufacturing and copper-plating, and can solve the problems of rising cost of workpieces to be plated, increased electroplating costs, and the like

Inactive Publication Date: 2002-04-03
TOAGOSEI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the update of the electroplating tank leads to a significant increase in the cost of electroplating, which increases the cost of the workpiece to be plated

Method used

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  • Copper plated material, its manufacturing method and method for copper plating
  • Copper plated material, its manufacturing method and method for copper plating
  • Copper plated material, its manufacturing method and method for copper plating

Examples

Experimental program
Comparison scheme
Effect test

example 1-5

[0057] According to the embodiment described above, the basic copper carbonate is thermally decomposed at 800° C. for about 60 minutes to obtain copper oxide. (comparative example 1)

example 2

[0063] Copper oxide was obtained by thermally decomposing basic copper carbonate at 400° C. for about 60 minutes according to the above embodiment. (Comparative example 2-1)

Embodiment 3

[0069] Copper oxide

[0070] Washing conditions: add 500g of copper oxide powder to 4500g of water, stir for 10 minutes, filter and wash with water. 500 g of copper oxide powders were washed with 5000 g of water.

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Abstract

A copper electroplating material using as a copper supply source during preparation. Basic copper carbonate is formed in a reaction tank by deposition and heated to a temperature of between 250 DEG C. and 800 DEG C. in an atmosphere which does not form a reducing atmosphere which does not form a reducing atmosphere, to thereby be subjected to thermal decomposition, resulting in providing easily soluble copper oxide.

Description

technical field [0001] The present invention relates to a material for copper plating (hereinafter referred to as "copper plating material"), a manufacturing method thereof, and a method of copper plating, and more particularly to use as a supply source of copper ions in a copper plating bath for copper plating a workpiece A copper-plated material, a method for manufacturing the copper-plated material, and a copper-plated method using the copper-plated material. Background technique [0002] One of the known techniques for copper-plating an object to be plated (hereinafter referred to as "the piece to be plated") is to put the copper-plated material into a sulfuric acid solution used as an electrolyte, and between an insoluble anode and the piece to be plated as a cathode Copper plating method with current flow. In this method, copper oxide obtained by thermally decomposing basic copper carbonate is used as a copper plating material (see Japanese Patent No. 2,753,855). [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G3/00C01G3/02C25D3/38C25D21/14
CPCC25D3/38C25D21/14C01P2006/40C01G3/00C01G3/02
Inventor 松木诗路士秋山一则
Owner TOAGOSEI CO LTD
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