Multi-layer structure unit and its manufacturing method

Abstract

The purpose of the present invention is to correct the warpage of multilayer composite 5 in the process of alternatively forming conductor pattern 3 and insulation layer 4 on the insulation body substrate 2. In the process of alternatively forming conductor pattern 3 and insulation layer 4 on the insulation body substrate 2, the constituting material of the insulation layer is modified to be the other insulation material which can correct the warpage of the multilayer composite 5 according to the predetermined schedule, or in the forming step to constitute the multilayer composite 5 by the insulation substrate 2, conductor pattern 3 and insulation layer 4. Thus, the insulation layer 4 is formed, and thereby the warpage of the multilayer composite 5 can be corrected with high accuracy.

Description

technical field [0001] The invention relates to a multi-layer structural component made by laminating conductor patterns and insulating layers on an insulating substrate and a manufacturing method thereof. Background technique [0002] As one of the electronic components, there is a multilayer structural component composed of sequentially laminating conductor patterns through insulating layers on an insulator substrate. This multilayer structural member can be produced as follows (for example, refer to Patent Documents 1 and 2). For example, as shown in FIG. 2(a), a conductor pattern 21 is formed on an insulator substrate 20 with a conductor paste or the like, and then the conductor pattern 21 is sintered and the insulator pattern 21 and the conductor pattern 21 are cooled. The conductive pattern 21 shrinks during sintering, and the insulating substrate 20 and the conductive pattern 21 shrink during cooling. Since the conductor pattern 21 has a greater thermal contraction ...

AI Technical Summary

Problems solved by technology

Due to the warping of the laminate, similarly to the above, there arises the problem that it is difficult to fix the mother substrate, or that it is impossible to form the conductor pattern 21 with high precision.

In addition, when dividing the mother substrate for each multilayer structural member 23, the mother substrate cannot be divided according to the setting, and many defective products of the multilayer structural member 23 are formed, resulting in a problem that the yield of the multilayer structural member 23 is low.

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