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Heat conduction equipment applying semiconductor principle and uses thereof

A semiconductor and principle technology, applied in the field of heat conduction devices using semiconductor principles, can solve the problems of lack of heat insulation function, high cost, and inability to prevent permafrost thawing, and achieve the effect of being conducive to heat dissipation and low thermal conductivity

Inactive Publication Date: 2007-05-02
COLD & ARID REGIONS ENVIRONMENTAL & ENG RES INST CHINESE
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AI Technical Summary

Problems solved by technology

Although this thermal pile has the function of heat conduction, it does not have the function of heat insulation. When the ambient temperature is higher than the temperature of its lower part, the thawing effect of the ambient high temperature on the frozen soil cannot be prevented; and its heat dissipation is only point heat dissipation, which affects the area Large projects are expensive
Therefore, under the unique actual conditions of permafrost regions on the Qinghai-Tibet Plateau in my country, that is, the annual average ground temperature of permafrost is close to zero in many permafrost regions (called high-temperature permafrost). It is predicted that the climate of the Qinghai-Tibet Plateau will warm by 2.3°C in 50 years, and the high-temperature permafrost area will show a trend of rapid increase, resulting in the fact that these engineering measures are either not effective, or the cost is too high to be used in large quantities in linear engineering, or It only cools at the point, but it is difficult to meet the actual requirements of the project for cooling on the line and on the surface

Method used

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  • Heat conduction equipment applying semiconductor principle and uses thereof
  • Heat conduction equipment applying semiconductor principle and uses thereof

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Embodiment Construction

[0025] specific implementation

[0026] The present invention will further describe embodiment in conjunction with accompanying drawing:

[0027] Simulate in the laboratory the thermal conduction device that utilizes the semiconductor principle of laying 20cm in the lower part of the railway embankment. The structure of the device is referred to in FIG. The carrier 2 is selected with a compressive strength greater than 3Mpa / cm 2 The best thermal insulation material - diatomite, this material is far greater than the compressive strength of general thermal insulation materials currently used in frozen soil engineering is greater than 0.3Mpa / cm 2 Requirements; to a certain extent, it can control the heat flow in one direction and at the same time play a certain role in restricting the uneven deformation of the subgrade; and it has a strong adsorption force for the liquid working medium. When the working medium is in a liquid state, the working medium can be distributed uniforml...

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Abstract

The invention relates to a heat conductive apparatus applying semi-conductor principle and its use thereof wherein the apparatus comprises a housing, carrier and heat conducting working medium arranged in the hermetic vacuum housing, the invention can be used in the foundation construction of railroad, highway and other linear project and on the objects needing heat preservation. By using the characteristic of low thermal factor at positive temperature and high thermal factor at negative temperature of the system, the regulation between the temperature of the environment and the temperature of the protected objects can be realized.

Description

technical field [0001] The invention relates to a heat conduction device and its application, in particular to a heat conduction device utilizing the semiconductor principle which can insulate heat at a positive temperature and conduct heat at a negative temperature, and its application. Background technique [0002] With the development of national production and regional economy, our country has been continuously constructing engineering buildings such as railways, highways, oil pipelines, and optical cables in permafrost areas. Due to the influence of artificial engineering measures, the surface heat transfer conditions have been changed, especially in the high solar radiation areas of the Qinghai-Tibet Plateau. Due to artificial engineering, the heat-absorbing surface and heat-absorbing heat of engineering buildings have been greatly increased after implementation, making the lower part of the foundation of various engineering measures The overall heat balance of the per...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02E01B27/00C09K5/02
Inventor 俞祁浩程国栋马巍吴青柏
Owner COLD & ARID REGIONS ENVIRONMENTAL & ENG RES INST CHINESE
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