Heat conduction equipment applying semiconductor principle and uses thereof
A semiconductor and principle technology, applied in the field of heat conduction devices using semiconductor principles, can solve the problems of lack of heat insulation function, high cost, and inability to prevent permafrost thawing, and achieve the effect of being conducive to heat dissipation and low thermal conductivity
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[0025] specific implementation
[0026] The present invention will further describe embodiment in conjunction with accompanying drawing:
[0027] Simulate in the laboratory the thermal conduction device that utilizes the semiconductor principle of laying 20cm in the lower part of the railway embankment. The structure of the device is referred to in FIG. The carrier 2 is selected with a compressive strength greater than 3Mpa / cm 2 The best thermal insulation material - diatomite, this material is far greater than the compressive strength of general thermal insulation materials currently used in frozen soil engineering is greater than 0.3Mpa / cm 2 Requirements; to a certain extent, it can control the heat flow in one direction and at the same time play a certain role in restricting the uneven deformation of the subgrade; and it has a strong adsorption force for the liquid working medium. When the working medium is in a liquid state, the working medium can be distributed uniforml...
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