Polyamide-polyesteramide thermosol and its preparing process

A hot-melt adhesive and polyamide technology, applied in the direction of adhesives, etc., can solve the problems of unsatisfactory peel strength and high price

Inactive Publication Date: 2004-07-14
SICHUAN TIANYI COMHEART TELECOM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the domestically produced EVA vinyl acetate propionic acid blend hot melt adhesive is a low-temperature adhesive, which can only be used below 40°C; and for occasions with higher requirements for bonding conditions, TPX20-037 produced by Henkel, Germany is currently widely used. Hot melt adhesive, but the price of this adhesive is high, and the peel strength is not satisfactory under the environment of 60 ℃

Method used

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  • Polyamide-polyesteramide thermosol and its preparing process
  • Polyamide-polyesteramide thermosol and its preparing process

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Experimental program
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Embodiment 1

[0038] Reaction material: base material dimer acid ratio of main material: 1 mol,

[0039] Adipic acid ratio: 0.05 mol,

[0040] Terephthalic acid ratio: 0.05 mol,

[0041] Main ingredient ethylenediamine ratio: 1 mol,

[0042] Modifier: The proportion of nylon 1010 salt is 5% of the weight of the reaction material,

[0043] Nylon 66 salt proportioning is 20% of reaction material weight,

[0044] Caprolactam proportioning is 2% of reaction material weight,

[0045] Chain extender: The proportion of ethylene glycol is 0.5% of the weight of the reaction material,

[0046] Glycerol proportioning is 0.2% of reaction material weight,

[0047] Cross-linking agent: The ratio of diethylenetriamine is 0.2% of the weight of the reaction material,

[0048] Catalyst: the ratio of phosphoric acid is 0.01% of the total weight of the above reaction materials,

[0049] ...

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PUM

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Abstract

A thermosol with polyamide or polyesteramide structure is prepared from dibasic acid and dibasic amine as primary raw material, adding modifier, chain-enlarging agent, catalyst, antioxidant, anti-ageing agent, optical stabilizer and terminating agent through polycondensating reaction. Its molecular wegiht is about in the range 3000-40000 dalton. Its advantages are wide temp. range for application (-30- +60 deg.C), high adhesion and thermal stability, and low cost.

Description

technical field [0001] The invention relates to a hot-melt adhesive used for connecting heat-shrinkable sleeves for communication cable plastic sheaths, clothing, shoe-making, oil pipelines, and other products that require high bonding strength, and a preparation method. A hot-melt adhesive with polyamide and polyesteramide structure and a preparation method thereof. Background technique [0002] The communication cables laid now have various geographical and climate environments such as overhead, buried and submarine laying. Exposure to light, under the action of air pressure, it is easy to cause air leakage into the heat shrinkable sleeve, because the connection of the heat shrinkable sleeve is bonded and sealed by hot melt adhesive, especially for the joint seal of the air pressure maintenance type. High-quality hot-melt adhesive is required for bonding. The hot-melt adhesive used for connecting the heat-shrinkable sleeve of the strong fiber-reinforced communication cab...

Claims

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Application Information

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IPC IPC(8): C09J179/08
Inventor 李躍亨杨燕龙吴宏
Owner SICHUAN TIANYI COMHEART TELECOM
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