Method for measuring current of switch integrated into power module
A technology of power modules and switching currents, which is applied to the components of electrical measuring instruments, measuring electronics, and measuring devices. It can solve the problems of uneven winding, large volume, and uneven winding, and achieve compact structure, small volume, and The effect of improving the difficulty and accuracy
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[0060] The technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this does not limit the protection scope of the present application.
[0061] image 3 It is the internal packaging structure of the power module, including the bottom plate, the DBC substrate and the chip. The DBC substrate is composed of an upper copper layer, a ceramic substrate and a lower copper layer. The DBC substrate is welded on the bottom plate through the DBC solder layer, and the chip is welded on the top through the chip solder layer On the copper layer; the upper copper layer of the DBC substrate is generally provided with an island structure, and the power module can be an IGBT power module, a SiCMOSFET power module, or a SiC JFET power module.
[0062] The present invention is a switch current measurement method integrated into the power module, such as Figure 4 As shown in the figure, the current ...
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