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Control method, wafer reverse transfer method, post-processing device and wafer processing equipment

A control method and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as adverse effects of integrated circuit patterns on the wafer surface, residual water film at the stop position of the wafer, and damage to the pattern structure , to achieve the effect of improving the degree of intelligence, realizing wafer protection, and reducing wafer waste

Active Publication Date: 2022-08-02
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the wafer cleaning process, if there is an alarm or abnormal situation, the wafer cleaning stops suddenly in the middle. At this time, the wafer has not been completely moved out of the liquid surface, and the three-phase line of the wafer is prone to instability at the stop position, resulting in wafer Residual water film or water droplets appear at the stop position, and waste wafers appear; and, after the equipment is shut down, it is generally after troubleshooting such as alarms that the normal cleaning is continued. During this process, if the wafer is not cleaned in time If the wafer is exposed to the air for a long time during processing, it will adversely affect the integrated circuit pattern on the wafer surface, and may even destroy the pattern structure

Method used

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  • Control method, wafer reverse transfer method, post-processing device and wafer processing equipment
  • Control method, wafer reverse transfer method, post-processing device and wafer processing equipment
  • Control method, wafer reverse transfer method, post-processing device and wafer processing equipment

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Embodiment 1

[0065] like Figure 8 As shown, an embodiment of the present invention provides a control method applied to post-processing, including:

[0066] Step S81, after the wafer stops moving due to an abnormality in the wafer cleaning, the wafer position is determined according to the parameters of the actuator; specifically, the current specific movement position of the mechanism can be known according to the motor encoder data of each mechanism, so as to obtain the wafer Location.

[0067] Step S82 , according to different wafer positions, a corresponding abnormal processing prompt is given or wafer reverse transfer, wafer lift or wafer transfer is automatically performed.

[0068] Specifically include:

[0069] 1) If the wafer position is that the wafer has been completely removed from the liquid level, the operator is prompted to directly remove the wafer or automatically perform wafer transfer;

[0070] 2) If the position of the wafer is that the wafer is under the liquid lev...

Embodiment 2

[0074] like Figure 9 As shown, an embodiment of the present invention proposes a wafer reverse transfer method for responding to an abnormal pull-up alarm, including:

[0075] Step S91, after receiving the reverse transmission instruction, determine the position of the wafer and the state of the mechanism; wherein, the position of the wafer refers to the position of the wafer on the wafer lifting device 5, and can also reflect the lifting mechanism 51, The state of the mechanism of the follower mechanism 52 and the clamping mechanism 53 .

[0076] Specifically, the first in-position sensor 54 and the second in-position sensor 55 are used to detect whether the wafer is in position, and the motor parameters of the lifting mechanism 51 , the follower mechanism 52 and the clamping mechanism 53 are used to determine whether the wafer is in position. the position of the circle.

[0077] Step S92, according to the preset judgment condition and the pre-stored reverse transmission l...

no. 1 Embodiment approach

[0084] When the first in-position sensor 54 detects that a wafer is in position, and the second in-position sensor 55 does not detect that a wafer is in position, and the motor motion position parameter of the jacking mechanism 51 is smaller than the first reference point, such as Figure 4 As shown, the first reference point of the motor movement position of the jacking mechanism 51 is the position of the motor of the jacking mechanism 51 when the follower just starts to move, indicating that the wafer is currently only lifted by the jacking mechanism 51, that is image 3 In the state shown in , perform the following operations to perform the reverse transfer:

[0085] Control the lifting mechanism 51 to bring the wafer back to the lowest position;

[0086] After the system returns to normal, perform wafer cleaning and drying again.

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Abstract

The invention discloses a control method, a wafer reverse transfer method, a post-processing device and wafer processing equipment, and the control method comprises the steps: judging the position of a wafer according to the parameters of an execution mechanism after the wafer stops moving due to the abnormality in the wafer cleaning process; and according to different wafer positions, corresponding exception handling prompts are given or wafer reverse conveying, wafer lifting or wafer conveying is automatically executed.

Description

technical field [0001] The present invention relates to the technical field of chemical mechanical polishing post-processing, and in particular, to a control method, a wafer reverse transfer method, a post-processing device and wafer processing equipment. Background technique [0002] Integrated Circuit (IC) is the core and lifeblood of the development of the information technology industry. Integrated circuits are typically formed by sequentially depositing conductive, semiconducting, or insulating layers on a silicon wafer. Thus, a thin film formed by a filler layer is deposited on the surface of the wafer. During the fabrication process, the filler layer needs to be continuously planarized until the patterned top surface is exposed to form conductive paths between the raised patterns. [0003] Chemical mechanical polishing (Chemical Mechanical Planarization, CMP) is an ultra-precision surface processing technology to obtain global planarization in integrated circuit IC ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306H01L21/67H01L21/687
CPCH01L21/67276H01L21/67057H01L21/67034H01L21/68742H01L21/30625
Inventor 李长坤赵德文路新春
Owner HWATSING TECH
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