Multi-component glyoxal resin adhesive as well as preparation method and application thereof

Abstract

The invention discloses a multi-component glyoxal resin adhesive as well as a preparation method and application thereof. The multi-component glyoxal resin adhesive is composed of a glyoxal molecular chain segment, a urea molecular chain segment, a melamine molecular chain segment and a fatty amine molecular chain segment. The preparation method comprises the following steps: preparing a glyoxal urea initial polymer GU, preparing a glyoxal-urea-melamine initial polymer GUM, and preparing the multi-component glyoxal resin. The application is the application of the multi-component glyoxal resin adhesive in preparation of artificial boards. The glyoxal is used for replacing formaldehyde to synthesize the adhesive and is used for manufacturing the shaving board, the product is light in weight, high in strength, excellent in performance and free of hidden danger of formaldehyde release, meanwhile, due to the fact that the Maillard reaction is introduced in the preparation process of the shaving board, the shaving board product can be endowed with special fragrance, and unpleasant smell of the shaving board can be eliminated. The technology disclosed by the invention can also be used for producing medium-density fiberboards, plywood and other wood glued products.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a multi-component glyoxal resin adhesive and a preparation method and application thereof. Background technique [0002] Formaldehyde resin is the most important adhesive in the wood-based panel industry and is widely used in particleboard manufacturing. Due to the large amount of formaldehyde used in the synthesis process, there is a hidden danger of formaldehyde release during the use of particleboard. At the same time, due to the low functionality of formaldehyde, the overall performance of the resin adhesive is not high, which eventually leads to low physical and mechanical properties of particleboard, especially dimensional stability, which limits the use of particleboard. [0003] Due to the use of formaldehyde series adhesives in the manufacturing process of particleboard, and the high temperature in the drying and hot pressing process, the chemical bonds of...

AI Technical Summary

Problems solved by technology

Due to the large amount of formaldehyde used in the synthesis process, there is a hidden danger of formaldehyde release during the use of particleboard

At the same time, due to the low functionality of formaldehyde, the overall performance of the resin adhesive is not high, which eventually leads to the poor physical and mechanical properties of the particleboard, especially the dimensional stability, which limits the scope of use of the particleboard.

[0003] Due to the use of formaldehyde series adhesives in the manufacturing process of particleboard, and the high temperature in the process of drying and hot pressing, the chemical bonds of wood molecules are broken to release small molecular compounds, etc., resulting in the pungent smell of particleboard products, which will continue for a period of time, giving Unpleasant feeling for the user

[0004] In order to eliminate the hidden danger of formaldehyde release, isocyanate adhesives can be used in the manufacturing process of particleboard, but isocyanate adhesives have the following disadvantages: 1) The price of isocyanate is usually 3 to 5 times that of formaldehyde series resins, and the production cost is high; 2) The use of When producing particleboard with isocyanate adhesives, problems such as sticking to hot-pressed boards are prone to occur, and a release agent is required; 3) Isocyanate is easy to react with water, so there should be no water in the metering and pumping system, which is different from the widely used water-soluble glue. Poor resin system compatibility; 4) Isocyanate monomers are highly toxic and usually need to be produced in a fully enclosed environment

The above factors limit the application of isocyanate adhesives in particleboard production, and the market share is only about 5%.

[0005] Although there are also reports on the use of biomass adhesives such as soybean protein adhesives to produce particleboard, large-scale industrial applications have not been realized due to factors such as production technology and raw materials.

[0006] In order to eliminate the smell of particleboard, some factories use deodorant, but the effect is not obvious

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