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Integrated gradient material box body packaging structure for airtight rectangular connector

A rectangular connector and gradient material technology, which is applied to the components, connections, and coupling devices of connecting devices, can solve problems such as reducing internal stress, ensure compatibility, improve packaging reliability and integration density, and ensure air tightness. sexual effect

Active Publication Date: 2022-07-12
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to provide an integrated gradient material box packaging structure for airtight rectangular connectors; to solve the problem of thermal expansion coefficient matching, internal stress reduction, and welding airtightness in the airtight rectangular connector packaging of microwave components. , laser welding compatibility and other issues, improving the packaging reliability and integration density of microwave components

Method used

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  • Integrated gradient material box body packaging structure for airtight rectangular connector
  • Integrated gradient material box body packaging structure for airtight rectangular connector
  • Integrated gradient material box body packaging structure for airtight rectangular connector

Examples

Experimental program
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Effect test

Embodiment 1

[0043] like Figure 2-Figure 3 shown:

[0044] This embodiment is mainly applicable to the connection between the chip and the rectangular connector 3 in the high-density integrated design. The high-density integrated design described here specifically refers to: H-h≤0.5mm.

[0045] An integrated gradient material box body packaging structure facing an airtight rectangular connector 3, comprising a main body 1 provided with a rectangular connector packaging area and a chip mounting area, an adjustment device located in the rectangular connector packaging area and integrally formed with the main body 1 body 2 ; the thermal expansion coefficient of the regulating body 2 is smaller than that of the main body 1 and greater than that of the rectangular connector 3 ; the regulating body 2 is provided with mounting holes for installing the airtight rectangular connector 3 .

[0046] In the present invention, the main body 1 and the regulating body 2 are prepared by powder metallurgy...

Embodiment 2

[0063] like figure 1 , Figure 4 , Figure 5 As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the adjustment body 2 will be coplanar with the outer side of the main body 1; it is mainly suitable for the packaging of chips and rectangular connectors 3 in the case of non-high-density integrated design, described here. The non-high-density integrated design refers to H-h>0.5mm.

Embodiment 3

[0065] like figure 1 , Figure 4 , Figure 5 As shown, when packaging a chip or a rectangular connector 3 that is not designed for high-density integration;

[0066] The main body 1 and the regulating body 2 are made of two gradient materials of the main body 1 and the regulating body 2 into an integrated box body blank by powder metallurgy, and then the integrated gradient material is produced by the process route of precise numerical control machining and surface treatment. Box body packaging structure; wherein, the material of the main body 1 is 6063 aluminum alloy, and its thermal expansion coefficient is 23; the material of the regulating body 2 is AlSi composite material with a silicon content of 50%, the thermal expansion coefficient is 11, and the thermal expansion coefficient of the rectangular connector 3 shell is 5; the thermal expansion coefficient of the transition connecting section between the regulating body 2 and the main body 1 is 17;

[0067] By setting t...

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Abstract

The invention relates to the technical field of microelectronic packaging, and particularly discloses an integrated gradient material box body packaging structure for an airtight rectangular connector, which comprises a main body provided with a rectangular connector packaging area and a chip mounting area, and an adjusting body positioned in the rectangular connector packaging area and integrally formed with the main body, the thermal expansion coefficient of the adjusting body is smaller than that of the main body and larger than that of the rectangular connector; and the adjusting body is provided with a mounting hole for mounting the airtight rectangular connector. The problems of thermal expansion coefficient matching, internal stress reduction, welding airtightness, laser welding compatibility and the like in microwave piece airtight rectangular connector packaging are solved, and the packaging reliability and integration density of microwave pieces are improved.

Description

technical field [0001] The present invention relates to the technical field of microelectronic packaging, and more particularly, to an integrated gradient material box body packaging structure for an airtight rectangular connector. Background technique [0002] Electronic equipment and products continue to develop towards thinness, lightness, and compactness, and the integration density continues to increase. Hermetic rectangular connectors are more and more widely used in high-density integrated microwave components. The box used for airtight rectangular connector packaging not only needs to meet the reliability of the connector itself, but also needs to meet the support, protection, power supply, heat dissipation, sealing and other requirements of the internal microelectronic devices. For the demand of high-density microwave components, the traditional metal-based material box can only meet some requirements and has some defects, such as Kovar material has low thermal expa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/52H01R13/533
CPCH01R13/52H01R13/5216H01R13/533
Inventor 方杰崔西会王强何东吴昌勇许冰李文伍艺龙雷东阳吴婷张香朋叶永贵徐洋
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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