Colorless transparent polyimide film resistant to high temperature of 400 DEG C and preparation method thereof

A polyimide film, polyamic acid technology, applied in flat products, other household appliances, coatings, etc., can solve the problem of reduced device display accuracy, impact on display device quality and reliability, and poor optical alignment accuracy, etc. problem, to achieve the effect of wide application prospects and excellent thermal stability

Active Publication Date: 2022-07-05
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Secondly, if the flexible substrate cannot maintain excellent dimensional stability during the high temperature process, it will have a fatal impact on the quality and reliability of the final display device
For example, if the size of the substrate changes too much at high temperature, the optical alignment accuracy will deteriorate and internal stress will be generated between the material layer interfaces, resulting in a decrease in the display accuracy of the device and peeling between layers during bending.

Method used

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  • Colorless transparent polyimide film resistant to high temperature of 400 DEG C and preparation method thereof
  • Colorless transparent polyimide film resistant to high temperature of 400 DEG C and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The colorless transparent polyimide film resistant to high temperature of 400°C in this embodiment is completed according to the following steps:

[0025] 1. Add 150L of solvent: N,N-dimethylacetamide (DMAc) into the 300L dissolving kettle equipped with mechanical stirring and nitrogen inlet and outlet, and feed nitrogen. Four diamine monomers of FFDA, TFDB, FDA and FA are added to the dissolving kettle, and the molar ratio of the substances is FFDA:TFDB:FDA:FA=2:3:2:3; stir until completely dissolved to obtain a mixed two Amine solution; the volume ratio of diamine weight to aprotic polar solvent is 16Kg:150L.

[0026] 2. The mixed diamine solution in the dissolving kettle is all pressed into the 300L resin kettle equipped with mechanical stirring and nitrogen inlet and outlet through the pressure pump, and nitrogen is introduced. Then, 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in several times, and the ratio of the substances was 6FDA:BTDA:BPAF...

Embodiment 2

[0034] The colorless transparent polyimide film resistant to high temperature of 400°C in this embodiment is completed according to the following steps:

[0035] 1. Add 150L of N,N-dimethylformamide into the 300L dissolving kettle equipped with mechanical stirring and nitrogen inlet and outlet, and feed nitrogen. Four diamine monomers, FFDA, TFDB, FDA, and FA, were added to the dissolving kettle, and the molar ratio of the substances was FFDA:TFDB:FDA:FA=17:1:1:1; stirred until completely dissolved to obtain mixed two Amine solution; the volume ratio of diamine weight to aprotic polar solvent is 12.0Kg:150L.

[0036] 2. The mixed diamine solution in the dissolving kettle is all pressed into the 300L resin kettle equipped with mechanical stirring and nitrogen inlet and outlet through the pressure pump, and nitrogen is introduced. Then, 6FDA, BTDA, BPAF mixed dianhydride was added into the resin kettle in several times, and the ratio of the substances was 6FDA:BTDA:BPAF=16:2:2....

Embodiment 3

[0044] The colorless transparent polyimide film resistant to high temperature of 400°C in this embodiment is completed according to the following steps:

[0045] 1. Add 150LN-methylpyrrolidone to the 300L dissolving kettle equipped with mechanical stirring and nitrogen inlet and outlet, and feed nitrogen. Add FFDA, TFDB, FDA, FA four diamine monomers into the dissolving kettle, and the molar ratio of the substances is FFDA:TFDB:FDA:FA=1:17:1:1; stir until completely dissolved to obtain a mixed two Amine solution; the volume ratio of diamine weight to aprotic polar solvent is 13Kg:150L.

[0046] 2. The mixed diamine solution in the dissolving kettle is all pressed into the 300L resin kettle equipped with mechanical stirring and nitrogen inlet and outlet through the pressure pump, and nitrogen is introduced. Then, 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in several times, and the ratio of the substances was 6FDA:BTDA:BPAF=3:14:3. The molar ratio of the ...

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Abstract

The invention discloses a colorless transparent polyimide film resistant to high temperature of 400 DEG C and a preparation method thereof. The method comprises the following steps: dissolving mixed diamine in an aprotic polar solvent, adding mixed dianhydride in batches, carrying out condensation polymerization to obtain a precursor polyamide acid solution, casting the precursor polyamide acid solution on a steel belt through a casting machine, and baking to reduce the content of the aprotic polar solvent, so as to obtain the self-supporting film. Carrying out thermal imidization and stretching treatment on the self-supporting film; and finally, cooling and treating to obtain the CPI film. Mixing diamine: 9, 9-bis-(3-fluoro-4-aminophenyl) fluorene: 2, 2 '-bis (trifluoromethyl) diaminobiphenyl: 9, 9-bis-(4-aminophenyl) fluorene: 2, 2-bis (4-aminophenyl) hexafluoropropane; the mixed dianhydride comprises 9, 9-bis (3, 4-dicarboxylphenyl) fluorene dianhydride: 4, 4 '-(hexafluoroisopropylidene) diphthalic anhydride: 3, 3', 4, 4 '-benzophenonetetracarboxylic dianhydride, the cold and hot shrinkage ratio of the prepared CPI film at 400 DEG C is not higher than 0.20%, and the light transmittance of the film with the thickness of 75 microns at 450 nm is larger than or equal to 89%.

Description

technical field [0001] The invention relates to a colorless transparent polyimide film resistant to a high temperature of 400 DEG C and a preparation method thereof. Background technique [0002] The flexible substrate is an important part of the entire flexible display device, and plays an important role in protecting and supporting the flexible device. Its performance directly affects the quality and service life of the flexible electronic device. It is the key to the realization of flexible display technology and the research process. difficulty. At present, colored polyimide (PI) suitable for top-emission devices has begun to be widely used in flexible display devices due to its excellent high temperature, dimensional stability and good mechanical properties. However, colored PI will reduce the transmittance of the flexible electrode, affect the absorption and transmission of light, and lead to the degradation of device performance. In contrast, a colorless transparent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10B29C41/28B29C55/16B29L7/00
CPCC08J5/18C08G73/1007C08G73/1042C08G73/1039C08G73/1067B29C41/28B29C55/16B29L2007/00C08J2379/08
Inventor 冷劲松肖鑫礼刘彦菊孔德艳
Owner HARBIN INST OF TECH
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