Head-mounted device

Abstract

The invention discloses a head-mounted device, which comprises a shell, a circuit board and a damper, and is characterized in that the circuit board is located at the inner side of the shell; the damper is arranged between the circuit board and the shell; the damper comprises a cylinder body, a push rod and a piston plate; an opening is formed in one end of the cylinder body, the first end of the push rod is connected with the shell, and the second end of the push rod is located at the opening; the piston plate is arranged at the second end of the push rod, and the periphery of the piston plate is in zero fit with the inner wall of the cylinder body; the piston plate can do reciprocating motion in the cylinder body, and vibration isolation is formed on the load transmitted to the circuit board from the shell. The damper is adopted to isolate vibration of the load transmitted to the circuit board from the shell, and compared with the mode that a rigid body structure is adopted to resist impact load in the prior art, the load transmitted to the circuit board is greatly reduced, and electronic devices on the circuit board can be effectively protected.

Description

technical field [0001] The present application relates to the technical field of electronic devices, and more particularly, to a head-mounted device. Background technique [0002] After years of development, various basic functions of head-mounted devices have been basically perfected. With the demand for more immersive experience, the possibility of accidentally falling off the human body during the game experience is further increased. When the head-mounted device is dropped, it will have a large impact force on the casing, which is easy to damage the internal components, especially the electronic components on the circuit board. [0003] In the prior art, most head-mounted devices have no impact-resistant design, or are limited to increasing the material thickness of the casing of the head-mounted device, or designing bumpers in the head-mounted device to increase local stiffness. To improve the impact resistance of the product, but the final effect is limited, and it ca...

AI Technical Summary

Problems solved by technology

When the headset falls, it will have a large impact on the shell, which is easy to damage the internal components, especially the electronic components on the circuit board.

[0003] In the prior art, most head-mounted devices do not have impact-resistant design, or are limited to increasing the material thickness of the shell of the head-mounted device, or designing anti-collision columns in the head-mounted device to increase local stiffness To improve the impact resistance of the product, but the final effect is limited, and it cannot protect the internal components of the headset well.

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