A kind of optoelectronic hybrid packaging structure and its manufacturing method

A packaging structure and photoelectric hybrid technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of large thickness and poor heat dissipation of optical communication modules, and achieve high efficiency and improve heat dissipation efficiency.

Active Publication Date: 2022-08-05
威海三维曲板智能装备有限公司
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  • Abstract
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Problems solved by technology

In this way, the thickness of the obtained optical communication module is relatively large, and the heat dissipation is poor.

Method used

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  • A kind of optoelectronic hybrid packaging structure and its manufacturing method
  • A kind of optoelectronic hybrid packaging structure and its manufacturing method
  • A kind of optoelectronic hybrid packaging structure and its manufacturing method

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Embodiment Construction

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.

[0029] Unless otherwise defined, technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. As used in this disclosure, "first," "second," and similar terms do not denote any order, quantity, or importance, but are merely used t...

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Abstract

The invention provides an optoelectronic hybrid packaging structure and a manufacturing method thereof, and relates to the technical field of packaging and testing of semiconductor chips. In the present invention, the packaging layer on the bottom side is formed first, and then the lead frame is used for bonding to realize the hybrid packaging of the optical chip and the electrical chip. The raised part of the two pins realizes heat dissipation at the top and improves the heat dissipation efficiency, and the thermally conductive metal block and the raised part are staggered in the lateral direction to achieve high heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of packaging and testing of semiconductor chips, in particular to an optoelectronic hybrid packaging structure and a manufacturing method thereof. Background technique [0002] For an optical communication module, it is often necessary to integrate an optical chip and an electrical chip. The problem of heat dissipation of the module and the problem of thinning of the package are urgently needed to be solved. In the existing optoelectronic hybrid packaging structure, the upper and lower surfaces of the interposer are often used to integrate the optical chip and the electrical chip, or the optical chip and the electrical chip are stacked on the interposer, so as to realize the integrated packaging of the optical communication module. In this way, the obtained optical communication module has a large thickness and poor heat dissipation. SUMMARY OF THE INVENTION [0003] Based on solving the above problems, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31H01L23/367H01L23/373H01L23/495H01L25/16
CPCH01L21/568H01L23/3107H01L23/367H01L23/3736H01L23/49568H01L25/167H01L2924/181H01L2224/48091H01L2924/00012H01L2924/00014
Inventor 张曙光
Owner 威海三维曲板智能装备有限公司
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