Anti-collision control method

A control method and anti-collision technology, applied in the direction of comprehensive factory control, manufacturing tools, grinding machine tools, etc., can solve the problems of poor reliability and easily damaged equipment, achieve high accuracy, ensure work efficiency, and prevent collision damage

Active Publication Date: 2022-06-07
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects of poor reliability and easy damage to equipment in the method of artificially monitoring the safety of scanning formulas in the prior art, so as to provide a method with strong reliability, high accuracy, and protection equipment that is not easily damaged. Anti-collision control method

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Embodiment Construction

[0055] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0056] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must hav...

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Abstract

The invention relates to the technical field of semiconductor processing equipment, and aims to provide an anti-collision control method which is high in reliability and accuracy when monitoring and scanning formula safety. The anti-collision control method comprises the following steps: acquiring a first moving part predicted position SAi and a second moving part predicted position SBi at a t0 + i * delta t moment; calculating the distance Q between the two; if the distance Q is smaller than or equal to the collision distance delta Q, the movement directions of the two are judged, if the two move oppositely, the two possibly collide at the moment t0 + i * delta t and need to avoid, and if the two move oppositely, the two do not collide at the moment t0 + i * delta t; and if the distance Q is greater than the collision distance delta Q, indicating that the two do not collide, and judging whether the two collide at every delta t moment within the total execution time T according to the steps. The problems that an existing method for manually monitoring and scanning the safety of the formula is poor in reliability and equipment is prone to being damaged are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to an anti-collision control method. Background technique [0002] Chemical mechanical planarization (Chemical-Mechanical Planarization, CMP for short) plays an important role in the semiconductor process and is a key process for realizing wafer surface planarization. During the working process of the CMP equipment, the wafer is installed on the polishing head, the polishing head presses the wafer, and the chemical mechanical polishing is performed through the contact between the wafer and the surface of the polishing pad. In turn, the surface topography of the wafer is affected by the surface topography of the polishing pad. [0003] During the polishing process, the polishing head and the dresser perform a scanning motion on the polishing pad according to the set scanning recipe in addition to their own rotational motion. For different wafer products, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/005B24B55/00
CPCB24B37/00B24B37/005B24B55/00Y02P90/02
Inventor 吴燕林周庆亚李嘉浪张康刘福强
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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