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Electronic equipment frame

A technology of electronic equipment and frame, applied in the field of consumer electronics, can solve the problems of high cost, increased thickness of the whole machine, limited flexibility of the frame, etc., and achieves the effect of low cost, short working hours, and avoiding false detection of the air tightness of the glue line.

Active Publication Date: 2022-06-03
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, to process the full CNC surface is to grind the step difference one by one or grind it to a small size, which takes a long time and high cost
Processing the all-plastic surface requires increasing the thickness of the plastic, resulting in an increase in the thickness of the whole machine, which limits the material selection of the frame and the flexibility of the structural design. If the thickness of the metal material is reduced, the structural strength of the frame will be reduced

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0032] First please refer to figure 1 , the display screen 200 of the smart terminal product is usually bonded to the top surface of the fuselage frame 100 through the glue line 300 , and the rear shell is bonded to the bottom surface of the fuselage frame 100 . The intelligent terminal product may specifically be a mobile phone, and may also be a watch, a tablet, or the like. The glue line 300 needs to be tested for airtightness to ensure that the glue line 300 is bonded continuously without breakpoints. When testing for air tightness, such as figure 2 As shown, the frame 100 bonded with the display screen 200 cooperates with the fixture 400 to form a closed space A, and a certain air pressure (positive pressure or negative pressure) is applied to the closed space A through the equipment. After the air pressure stabilizes to a certain value, the pressure is maintained for a period of time. Time, such as 5-10s, to detect the air pressure change in the closed space A, to det...

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PUM

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Abstract

The invention provides an electronic equipment framework. The electronic equipment frame comprises a frame and a transition part. The top surface of the frame is used for mounting the display screen, the bottom surface is used for mounting the rear shell, the rear shell is connected with the frame through a rear shell mounting surface on the bottom surface of the frame, a continuous extension part is arranged around the outer edge of the bottom surface of the frame, and the extension part surrounds the rear shell mounting surface. And the transition part is arranged on the bottom surface of the frame, is positioned between the rear shell mounting surface and the extension part, and is connected with the rear shell mounting surface. When the above structure is adopted, the sealing effectiveness between the frame and the clamp during the rubber line air tightness detection is improved, and the problem of rubber line air tightness error detection caused by segment difference of heterogeneous combination segments is solved.

Description

technical field [0001] The present application relates to the technical field of consumer electronics, and in particular, to an electronic device frame. Background technique [0002] Smart terminal products mainly use dispensing or back glue to form a glue line between the display screen and the frame to realize the bonding and sealing of the display screen and the frame. In order to ensure that the glue line is bonded continuously without breakpoints and there is no risk of liquid ingress, it is necessary to conduct air tightness testing on the glue line. The air-tightness detection of the glue line requires the frame with the display screen to cooperate with the fixture to form a closed space, and the original opening on the frame is effectively sealed by the fixture. The surface on the frame that is in contact with the fixture for sealing is usually the backplane (BackPlane, BP) surface, that is, the mounting surface of the rear shell, also called the bonding surface of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/18H05K5/00H05K5/02H05K5/06
CPCH05K7/18H05K5/0217H05K5/06H05K5/0017
Inventor 汪源王洪星冯鑫友
Owner HONOR DEVICE CO LTD
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