Electronic component and method for setting power supply circuit of electronic component

Abstract

The invention provides an electronic component and a method for setting a power supply circuit of the electronic component. According to the electronic assembly provided by the invention, the PMIC with small power consumption in the electronic assembly is moved to the packaging substrate closer to the chip from the position, close to the edge, of the PCB substrate, so that the power supply distance of the PMIC with small power consumption can be shortened, the power consumption is reduced, the power supply quality of the PMIC with small power consumption is improved, and particularly, the PMIC is used for supplying power to a simulation IP core, so that the power supply efficiency is improved. The power supply quality of the whole electronic component is obviously improved; moreover, more power supply layout resources on the PCB substrate can be released to be used by a high-power-consumption power supply device, so that the loss (such as copper loss) of the high-power-consumption power supply device can be reduced, the board-level loss of the power supply part of the electronic component is reduced, and the power consumption margin of the power supply part of the electronic component is increased.

Description

technical field [0001] The present application relates to the field of integrated circuits, and in particular, to an electronic component and a method for setting a power supply circuit for the electronic component. Background technique [0002] A semiconductor package such as a flip chip (FCCSP) can be formed by packaging chips on a printed circuit board (PCB) substrate (also called a PCB single board). This chip is soldered to the circuit pattern of the printed circuit board. The PCB substrate also needs to have a power supply device for supplying power to the packaged chips. The entire circuit board formed can be referred to as an electronic assembly. [0003] With the development of semiconductor technology, the integration of chips is getting higher and higher, especially System on Chip (SoC), which can integrate multiple chip die and intellectual property (IP) cores, IP cores provided by different manufacturers Different power supply voltages are required, and the s...

AI Technical Summary

Problems solved by technology

[0004] At present, the chip is usually placed in the central area of ​​the PCB substrate, and the PMIC and power supply are arranged on the PCB substrate close to the edge area. A large number of high-speed / low-speed signal traces are laid between the chip and the PMIC and power supply. / Surrounded by low-speed signal traces, the power supply path is very long, resulting in increased power consumption of electronic components and poor power supply quality

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