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Optical module

An optical module and laser technology, applied in the field of optical modules, can solve the problems of poor impedance matching between the laser driver chip and the laser chip, affecting high-frequency performance, etc., and achieve the effect of avoiding reflection and improving matching accuracy

Pending Publication Date: 2022-05-27
HISENSE BROADBAND MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually the output impedance of the laser driver chip is a fixed value, but the resistance of the laser is 5~10Ω, which is not a constant value. There will be a problem of poor impedance matching between the laser driver chip and the laser chip, which will affect the high frequency performance.

Method used

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Embodiment Construction

[0029] In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the present application.

[0030] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals that carry information to transmit in information transmission equipment such as optical fibers / optical waveguides. The passive transmission ch...

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Abstract

The invention provides an optical module comprising a circuit board provided with a laser driving chip; a tube socket; the pin is arranged on the tube seat; comprising a cathode pin and an anode pin and is electrically connected with the laser driving chip; the ceramic substrate is arranged on the tube socket; the surface of the ceramic substrate comprises a negative electrode metal area, a positive electrode metal area and a chip metal area; a cathode is arranged at the bottom of the laser chip, an anode is arranged at the top of the laser chip, and the bottom of the laser chip is arranged on the surface of the chip metal area to realize electric connection between the cathode and the chip metal area; the anode is connected with the anode metal area through a wire; the positive electrode metal area is electrically connected with the positive electrode pin; the negative electrode metal region comprises a first conductive region, a first thin-film resistor and a second conductive region; the first thin-film resistor is communicated with the first conductive region and the second conductive region; the first conductive region is also electrically connected with the negative electrode pin; and the chip metal region is electrically connected with the first conductive region or the second conductive region through a wire so as to meet the impedance matching requirement of the chip.

Description

technical field [0001] The present application relates to the field of communication technologies, and in particular, to an optical module. Background technique [0002] Due to the higher and higher requirements for communication bandwidth in the field of optical fiber communication, the global optical communication is in a period of rapid development. In the field of high-speed data communication, in order to ensure long-distance and high-speed transmission of data, optical modules are usually used in the field to transmit and receive light of different wavelengths. [0003] The existing optical module usually refers to an integrated module for photoelectric conversion. For optical signal transmission, a laser chip is usually used to convert the electrical signal from the host computer into an optical signal. In order to provide a flat optical bearing surface for the laser chip, the laser chip is usually arranged on a ceramic substrate, the surface of the ceramic substrate...

Claims

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Application Information

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IPC IPC(8): G02B6/42H04B10/25
CPCG02B6/4274G02B6/4281
Inventor 张晓磊李永勃
Owner HISENSE BROADBAND MULTIMEDIA TECH
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