Vaporization device for thin film deposition

Abstract

The vaporization device of the present invention may comprise: a sprayer that mixes a source injected through a source injection port and a carrier gas injected through a carrier gas injection port, and sprays the mixed gas; a vaporizing part having first and second vaporizing spaces for vaporizing the mixed gas ejected from the atomizer, and discharging the vaporized gas as a process gas through an outlet; and the heating part is used for keeping the mixed gas in the vaporization part at a preset temperature. The heating unit may include: a first heating unit arranged to surround the first vaporization space so as to maintain the temperature of the mixed gas in the first vaporization space; and a second heating part which is arranged together with the first heating part so as to surround the second vaporization space and maintain the temperature of the mixed gas in the second vaporization space.

Description

technical field [0001] The present invention relates to a vaporization device for thin film deposition, and more particularly to a vaporization device for thin film deposition with high vaporization efficiency used in semiconductor manufacturing. The heater structure can be improved to prevent the re-condensation of sprayed droplets. Background technique [0002] Generally, semiconductor elements or display elements, etc. are manufactured by performing a series of processes such as thin film deposition process and photolithography process using a semiconductor manufacturing apparatus. In such a series of processes, a thin film deposition process for forming a thin film on a substrate may be performed by a chemical vapor deposition (CVD) method or an atomic layer deposition (ALD) method. [0003] Generally, the thin film deposition process is a process of injecting a process gas into a process chamber to cause a reaction on a substrate (wafer) to form a thin film on the subst...

AI Technical Summary

Problems solved by technology

However, the vaporization method of the decompression method can only vaporize a part of the liquid source, and there is always the problem of reducing the vaporization efficiency

Therefore, in order to vaporize all or more than the required amount of the liquid source, the structure of the vaporization device should become complicated or enlarged.

[0007] In addition, due to the complexity and size of the vaporization device, the source of vaporization in the vaporization device may be re-liquefied while flowing through the complicated flow path in the vaporization device.

In addition, when a large number of sources need to be vaporized, the vaporization device will be more complicated and larger. Therefore, while the above-mentioned problems are aggravated, the design of the vaporization device is more complicated and the production cost increases.

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