Floating point pressure module and working mode thereof

Abstract

The invention discloses a floating point pressure module and a working mode thereof. The floating point pressure module comprises a lower die structure and an upper die structure, the upper die structure comprises an upper die guide plate, a punch structure, a floating soft plate and an upper die air inlet plate. In the pressing process, the FPC board is placed at the designated position of the lower die structure, the upper die structure moves towards the lower die structure under driving force, and therefore the FPC board is pressed. An upper die guide plate in the upper die structure is attached to the lower die structure, inflation is carried out through an upper die air inlet plate, a floating soft plate moves towards the punch structure under the air pressure, punch pressing force is applied to the designated position of an FPC board, and therefore the pressing work of different position points is completed. And due to the arrangement of the floating soft plate, the stress among different punches is balanced, so that the problem that the stress condition among different pressing points is unstable in the original pressing process is solved, and the quality of an FPC (Flexible Printed Circuit) board is greatly improved.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a floating point pressure module and its working mode. Background technique [0002] Flexible Printed Circuit (FPC for short) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. , light weight, thin thickness, good bending and other characteristics are widely used in different industries. [0003] In the production process of the FPC board, it is necessary to carry out the pressing work on the designated points, so as to press the multi-piece products coated with the adhesive to the FPC board. [0004] According to the needs of the position of the pressing point of the FPC board, all the punches are made on the same pressing board. After the equipment is started, the pressing board is driven by the power module and moves to the direction of the bearing module loaded with the FPC board to clamp the multi-layer products. ....

AI Technical Summary

Problems solved by technology

[0005] However, this kind of point pressing module has great disadvantages: firstly, all the punches are made on one plate, which leads to high requirements on the processing precision of its flatness, parallelism, etc., not only the processing cost is high, but also Dimensional errors of any punch will lead to the scrapping of the entire pressure plate, thereby increasing loss; secondly, the assembly of the pressure plate is more difficult. During the assembly process, its parallelism, flatness and running accuracy are difficult to guarantee, such as The parallelism accuracy is not high, which will lead to differences in the pressing force of the punches at both ends of the pressing plate to the FPC board on the carrier plate during stamping, resulting in weak pressing or broken internal lines of the FPC board, which will affect the product yield; Thirdly, it is more troublesome to replace the pressure plate in the later stage, and the maintenance cost is relatively high; in addition, the current FPC board is gradually developing in the direction of large size, so that the corresponding pressure plate size and the number of punches also increase. However, the current processing machine tool accuracy is difficult to meet Requirements, when the length of the platen is 2 meters in general machine tools, the actual flatness can only be guaranteed within 0.05mm (refer to GB / T1184-1996 IT6 tolerance), and the actual product, the punch height difference of 0.01mm will also cause FPC The board is under uneven pressure, and the product is over-pressurized, causing the internal circuit of the circuit board to be broken, etc.

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