Semiconductor structure and chip packaging method

Abstract

The invention provides a semiconductor structure and a chip packaging method. The semiconductor structure comprises a substrate, a first chip and a second chip, wherein the first chip and the second chip are arranged on the substrate in parallel; wherein the first chip and the second chip are interconnected directly through a lead bonding process; moreover, for the pins, where high-speed signals need to pass, between the first chip and the second chip, the pins are configured to be oppositely arranged and are connected through parallel routing. According to the embodiment of the invention, through a lead bonding technology between chips, the circuit is shorter in routing, small in occupied space, better in performance of high-speed signals, free of too much change in cost, and even lower in cost. Compared with 2.5 D and 3D packaging, the cost of the embodiment is much lower, the requirement for manufacturing equipment is not high, and the method is very suitable for large-scale production.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor structure and a chip packaging method. Background technique [0002] With the development of semiconductor technology, the scale of the chip is getting larger and larger, and the chip integrated on the package is also becoming more and more complex. When packaging, it is often necessary to integrate a variety of different chips, such as memory + logic chips, optoelectronics + electronic components, etc., through packaging, 3D stacking and other technologies to achieve smaller volume and power consumption. [0003] In some applications, for chips with fewer input and output pins, if two chips need to be interconnected, the general methods are: [0004] 1. Use wire bonding, and then connect through the package substrate (Substrate). [0005] Wire bonding technology is the main technology of traditional packaging, which has the advantages of low cost, high re...

AI Technical Summary

Problems solved by technology

There are also some methods that mix the above methods, but in general, either the improvement is not enough, or the complexity and cost of the system are greatly increased, so it cannot meet the use requirements

Images