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Device and method for resin plugging hole of double-sided back-drilled printed circuit board

A technology for printed circuit boards and resin plug holes, which is used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of resin plug holes, difficult to fill and fill, etc., and achieves the effect of ingenious structure

Active Publication Date: 2022-06-03
四川英创力电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resin plugging is usually required after the back drilling process is completed. However, when the printed circuit board has back drilling holes on both sides, when the resin plugs the holes, because the back drilling holes on the bottom surface are small at the top and large at the bottom, the resin is filled from the upper part of the hole, which is very difficult. Difficult to fill fully, so there will be voids in the resin plug hole

Method used

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  • Device and method for resin plugging hole of double-sided back-drilled printed circuit board
  • Device and method for resin plugging hole of double-sided back-drilled printed circuit board
  • Device and method for resin plugging hole of double-sided back-drilled printed circuit board

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Experimental program
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Effect test

Embodiment 2

[0051] As shown in FIG. 8, the present embodiment provides a double-sided back-drilling printed circuit board resin plugging method, using the embodiment

[0054] The printed circuit board 5 is placed in the card slot 34 with the top facing upwards;

[0056] The grease injection pipe head 211 of the resin injection assembly 21 is lowered to a suitable position, and the resin is injected into the first back hole 5-1.

[0059] At the beginning, the runner 42 is rotated and matched with one of the arc-shaped plates 432, so the guide plate 43 will not rotate;

[0064] Like the first resin plug hole, the grease injection pipe head 211 of the resin injection assembly 21 is lowered to a suitable position, and the resin

[0067] The vacuum suction hole 35 stops suction, and the printed circuit board 5 can be pushed from the card slot 34 to the through slot 61 by using the push assembly,

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Abstract

The invention discloses a double-sided back-drilling printed circuit board resin plug hole device and method. The resin plugging device includes a turning mechanism, a vacuum resin plugging machine and several bearing mechanisms arranged in a horizontal array. Each bearing mechanism includes a first bevel gear connected in sequence, a horizontal rod and a bearing frame. The horizontal rod is connected to the support rod through a bearing. , the top and bottom surfaces of the bearing frame are provided with card slots, and the card slots are provided with vacuum adsorption orifice plates; the turning mechanism is connected to the first bevel gears, and is used to rotate all the first bevel gears at the same time; the vacuum resin plugging machine includes The upper resin injection assembly and the air pump air extraction assembly are located below the carrier frame. The resin plugging device can turn the printed circuit board over and fill the back-drilled holes on both sides of the printed circuit board with resin respectively, without voids.

Description

A double-sided back-drilling printed circuit board resin plugging device and method technical field The present invention relates to printed circuit board processing technical field, relate in particular to a kind of double-sided back-drilling printed circuit board resin plug Orifice device and method. Background technique [0002] With the development of the printed circuit board, the printed circuit board often needs to design back-drilling holes, and the back-drilling holes are the Part of the hole wall copper is drilled to avoid shielding the signal on the inner layer. After the back-drilling process is completed, the back-drilled part of the hole diameter is more secure. Leave some holes larger. Resin plug holes are usually required after the back drilling process is completed, however, there are back holes printed on both sides When the circuit board is plugged with resin, because the back drilling on the bottom surface is small at the top and the bottom is lar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 胡志强李清华张仁军杨海军牟玉贵邓岚
Owner 四川英创力电子科技股份有限公司
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