Top plate assembly and motion positioning device with same

A technology for top plates and components, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to solve problems such as decreased motion accuracy

Pending Publication Date: 2022-04-05
YINGUAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a top plate assembly and its motion positioning device to solve the problem that the motion accuracy of the XY motion table in the prior art will be reduced due to the influence of the magnetic attraction force between the stator and the mover of the motor question

Method used

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  • Top plate assembly and motion positioning device with same
  • Top plate assembly and motion positioning device with same
  • Top plate assembly and motion positioning device with same

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Embodiment Construction

[0043] It should be noted that the features of the present application and the features in the embodiments in the present application can be combined with each other in the case of an unable conflict. The present invention will be described in detail below with reference to the accompanying drawings.

[0044] Such as Figures 1 to 10 As shown, the present invention provides a top plate assembly, the top plate assembly is disposed on the mounting plate 20 of the moving positioning device for carrying the workpiece and the workpiece positioning, the top plate assembly includes: top plate 30, disposed above the mounting plate 20 for use Carrying the workpiece; a plurality of top plate slide 32, the top plate 30 can be inserted between the top plate rails 21 on the mounting plate 20 in the mounting plate 20 to interact to the top plate motor stator 22 and the top plate motor 33 The lower phase is moved to the mounting plate 20; the plurality of top slider 32 is located below the top pl...

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Abstract

The invention provides a top plate assembly and a motion positioning device with the top plate assembly, the top plate assembly is arranged on a mounting plate of the motion positioning device for bearing and positioning a workpiece, and the top plate assembly comprises a top plate arranged above the mounting plate for bearing the workpiece; the top plate is movably connected with the top plate guide rails on the mounting plate through the plurality of top plate sliding blocks positioned below the top plate so as to move relative to the mounting plate under the interaction of the top plate motor stator and the top plate motor rotor; the top plate motor stator is mounted on the mounting plate, and the top plate motor rotor is connected with the top plate through the adapter; the adapter comprises a plurality of supporting parts, the supporting parts are in point contact with the top plate, the contact points are located over the top plate sliding block, and the top plate provides vertically-upward supporting force for the adapter through the contact points. The problem that the motion precision of an XY motion platform in the prior art is reduced due to the influence of magnetic attraction force between a stator and a rotor of a motor is solved.

Description

Technical field [0001] The present invention relates to the technical field of wafer detecting equipment, and more particularly to a top plate assembly and a moving positioning device having it. Background technique [0002] In the field of manufacture or detection of semiconductor wafers, the workpiece is required to carry the silicon wafer to complete the fine positioning of the silicon wafer to facilitate the manufacture or detection of the silicon wafer. Therefore, in a workpiece table apparatus applied or detected by a silicon sheet, a two-axis motion device having a silicon wafer in X, Y2D plane is its core component. [0003] The development of the semiconductor industry is accompanied by continuous improvement of the manufacturing or detection efficiency of the silicon wafer and the requirements of manufacturing or detection accuracy, therefore, the operational speed, acceleration and performance of the two-axis moving device for carrying the silicon wafer also needs to b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
Inventor 唐艳文江旭初袁嘉欣
Owner YINGUAN SEMICON TECH CO LTD
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